Horiki; Seinosuke
Patent Applications and Registrations
Patent applications and USPTO patent grants for Horiki; Seinosuke.The latest application filed is for "resin composition, molding material, and molded object".
- Horiki; Seinosuke - Takai JP
- Horiki, Seinosuke - Takai-shi JP
- Horiki; Seinosuke - Tokai JP
- Horiki; Seinosuke - Nagoya JP
- Horiki; Seinosuke - Midori JP
| Patent | Date |
|---|---|
| Resin composition, molding material, and molded object Grant 6,794,034 - Ogawa , et al. September 21, 2 | 2004-09-21 |
| Resin composition, molding material, and molded object App 20030088025 - Ogawa, Masanori ; et al. | 2003-05-08 |
| Corrosion, sound, and vibration-proof method for metal structure Grant 5,540,880 - Horiki , et al. July 30, 1 | 1996-07-30 |
| Masking member Grant 5,328,723 - Horiki , et al. * July 12, 1 | 1994-07-12 |
| Panel type masking member Grant 5,206,069 - Horiki , et al. April 27, 1 | 1993-04-27 |
| Masking member Grant 5,164,238 - Horiki , et al. November 17, 1 | 1992-11-17 |
| Method of corrosion, sound, and vibration proofing of a metal structure Grant 4,913,786 - Horiki , et al. April 3, 1 | 1990-04-03 |
| Masking member Grant 4,868,045 - Horiki , et al. September 19, 1 | 1989-09-19 |
| Masking member Grant 4,844,285 - Horiki , et al. July 4, 1 | 1989-07-04 |
| Masking member Grant 4,835,026 - Horiki , et al. May 30, 1 | 1989-05-30 |
| Masking member Grant 4,822,650 - Horiki , et al. April 18, 1 | 1989-04-18 |
| Masking member Grant 4,764,421 - Horiki , et al. August 16, 1 | 1988-08-16 |
| Expanding and shrinking member Grant 4,714,633 - Horiki , et al. December 22, 1 | 1987-12-22 |
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