| Patent | Date |
|---|
Inductor and method of manufacturing same
Grant 11,437,174 - Horikawa , et al. September 6, 2 | 2022-09-06 |
Folded substrate for stacked integrated circuit devices
Grant 11,309,224 - Horikawa , et al. April 19, 2 | 2022-04-19 |
Inductor
Grant 10,395,810 - Nakamura , et al. A | 2019-08-27 |
Semiconductor Device
App 20190198411 - HORIKAWA; Yasuyoshi ; et al. | 2019-06-27 |
Inductor And Method Of Manufacturing Same
App 20180330861 - HORIKAWA; Yasuyoshi ; et al. | 2018-11-15 |
Optical sensor
Grant 10,115,878 - Horikawa October 30, 2 | 2018-10-30 |
Method of manufacturing an inductor
Grant 10,062,490 - Horikawa , et al. August 28, 2 | 2018-08-28 |
Optical Sensor
App 20170358723 - Horikawa; Yasuyoshi | 2017-12-14 |
Inductor Device And Method Of Manufacturing The Same
App 20170117219 - Horikawa; Yasuyoshi ; et al. | 2017-04-27 |
Wiring substrate, manufacturing method therefor, and semiconductor package
Grant 9,603,253 - Denda , et al. March 21, 2 | 2017-03-21 |
Wiring substrate and light emitting device
Grant 9,590,154 - Horikawa March 7, 2 | 2017-03-07 |
Inductor And Method Of Manufacturing Same
App 20160343489 - HORIKAWA; Yasuyoshi ; et al. | 2016-11-24 |
Inductor
App 20160343499 - Nakamura; Atsushi ; et al. | 2016-11-24 |
Wiring substrate
Grant 9,324,929 - Horikawa , et al. April 26, 2 | 2016-04-26 |
Wiring substrate and semiconductor package
Grant 9,282,629 - Horikawa , et al. March 8, 2 | 2016-03-08 |
Wiring Substrate
App 20150311417 - HORIKAWA; Yasuyoshi ; et al. | 2015-10-29 |
Wiring substrate and manufacturing method thereof
Grant 9,159,648 - Koizumi , et al. October 13, 2 | 2015-10-13 |
Wiring Substrate And Semiconductor Package
App 20150230328 - HORIKAWA; Yasuyoshi ; et al. | 2015-08-13 |
Wiring Substrate, Manufacturing Method Therefor, And Semiconductor Package
App 20150201485 - DENDA; Tatsuaki ; et al. | 2015-07-16 |
Wiring substrate, light emitting device, and manufacturing method of wiring substrate
Grant 9,084,372 - Muramatsu , et al. July 14, 2 | 2015-07-14 |
Wiring board and light emitting device
Grant 9,006,894 - Kobayashi , et al. April 14, 2 | 2015-04-14 |
Wiring Substrate and Light Emitting Device
App 20150060920 - HORIKAWA; Yasuyoshi | 2015-03-05 |
Wiring Board And Light Emitting Device
App 20140264417 - Kobayashi; Kazutaka ; et al. | 2014-09-18 |
Connecting terminal structure, manufacturing method of the same and socket
Grant 8,770,987 - Horikawa July 8, 2 | 2014-07-08 |
Connecting terminal structure, socket and electronic package
Grant 8,708,711 - Horikawa April 29, 2 | 2014-04-29 |
Wiring Substrate And Manufacturing Method Thereof
App 20140015121 - Koizumi; Naoyuki ; et al. | 2014-01-16 |
Wiring Substrate, Light Emitting Device, And Manufacturing Method Of Wiring Substrate
App 20130188361 - MURAMATSU; Shigetsugu ; et al. | 2013-07-25 |
Socket and method of fabricating the same
Grant 8,419,442 - Horikawa , et al. April 16, 2 | 2013-04-16 |
Connecting Terminal Structure, Socket And Electronic Package
App 20120258636 - HORIKAWA; Yasuyoshi | 2012-10-11 |
Connecting Terminal Structure, Manufacturing Method Of The Same And Socket
App 20120108108 - HORIKAWA; Yasuyoshi | 2012-05-03 |
Socket And Method Of Fabricating The Same
App 20120021625 - Horikawa; Yasuyoshi ; et al. | 2012-01-26 |
Encapsulated electronic part packaging structure
Grant 7,414,309 - Oi , et al. August 19, 2 | 2008-08-19 |
Semiconductor device substrate, semiconductor device, and manufacturing method thereof
Grant 7,402,900 - Ooi , et al. July 22, 2 | 2008-07-22 |
Capacitor device and semiconductor device having the same, and capacitor device manufacturing method
Grant 7,358,591 - Horikawa , et al. April 15, 2 | 2008-04-15 |
Semiconductor device substrate, semiconductor device, and manufacturing method thereof
Grant 7,358,114 - Ooi , et al. April 15, 2 | 2008-04-15 |
Method of manufacturing an electronic parts packaging structure
Grant 7,319,049 - Oi , et al. January 15, 2 | 2008-01-15 |
Method of manufacturing wiring substrate
Grant 7,276,438 - Horikawa , et al. October 2, 2 | 2007-10-02 |
Method of manufacturing electronic part packaging structure
Grant 7,229,856 - Oi , et al. June 12, 2 | 2007-06-12 |
Mounting substrate, manufacturing method of mounting substrate and manufacturing method of semiconductor device
App 20070119616 - Horikawa; Yasuyoshi ; et al. | 2007-05-31 |
Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device
Grant 7,223,652 - Ooi , et al. May 29, 2 | 2007-05-29 |
Electronic parts and method of manufacturing electronic parts packaging structure
App 20070052086 - Oi; Kiyoshi ; et al. | 2007-03-08 |
Coil Structure, Method For Manufacturing The Same And Semiconductor Package
App 20070040238 - Yamasaki; Tomoo ; et al. | 2007-02-22 |
Capacitor device and method of manufacturing the same
Grant 7,072,168 - Horikawa , et al. July 4, 2 | 2006-07-04 |
Capacitor and method of producing same
Grant 7,038,904 - Ooi , et al. May 2, 2 | 2006-05-02 |
Semiconductor device substrate, semiconductor device, and manufacturing method thereof
App 20060040424 - Ooi; Kiyoshi ; et al. | 2006-02-23 |
Substrate for carrying a semiconductor chip and a manufacturing method thereof
Grant 6,998,308 - Ooi , et al. February 14, 2 | 2006-02-14 |
Electronic part-containing elements, electronic devices and production methods
App 20060017133 - Oi; Kiyoshi ; et al. | 2006-01-26 |
Method of manufacturing wiring substrate
App 20050277282 - Horikawa, Yasuyoshi ; et al. | 2005-12-15 |
Substrate, semiconductor device, and substrate fabricating method
App 20050258509 - Horikawa, Yasuyoshi ; et al. | 2005-11-24 |
Electronic parts and method of manufacturing electronic parts packaging structure
App 20050258447 - Oi, Kiyoshi ; et al. | 2005-11-24 |
Method of manufacturing an electronic parts packaging structure
App 20050247665 - Oi, Kiyoshi ; et al. | 2005-11-10 |
Capacitor device and semiconductor device having the same, and capacitor device manufacturing method
App 20050199929 - Horikawa, Yasuyoshi ; et al. | 2005-09-15 |
Substrate for carrying a semiconductor chip and a manufacturing method thereof
App 20050185382 - Ooi, Kiyoshi ; et al. | 2005-08-25 |
Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device
App 20050130368 - Ooi, Kiyoshi ; et al. | 2005-06-16 |
Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device
Grant 6,897,544 - Ooi , et al. May 24, 2 | 2005-05-24 |
Capacitor and method of producing same
App 20050088800 - Ooi, Kiyoshi ; et al. | 2005-04-28 |
Capacitor device and method of manufacturing the same
App 20050013088 - Horikawa, Yasuyoshi ; et al. | 2005-01-20 |
Wiring substrate manufacturing method
App 20040265482 - Horikawa, Yasuyoshi ; et al. | 2004-12-30 |
Semiconductor device substrate, semiconductor device, and manufacturing method thereof
App 20040203193 - Ooi, Kiyoshi ; et al. | 2004-10-14 |
Process for manufacturing a wiring board
Grant 6,783,652 - Iijima , et al. August 31, 2 | 2004-08-31 |
Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device
App 20040104451 - Ooi, Kiyoshi ; et al. | 2004-06-03 |
Multi-layered semiconductor device and method of manufacturing same
App 20040090758 - Horikawa, Yasuyoshi | 2004-05-13 |
Substrate for carrying a semiconductor chip and a manufacturing method thereof
App 20040087058 - Ooi, Kiyoshi ; et al. | 2004-05-06 |
Multi-layered semiconductor device and method of manufacturing same
App 20030173676 - Horikawa, Yasuyoshi | 2003-09-18 |
Process for manufacturing a wiring board
App 20020066672 - Iijima, Takahiro ; et al. | 2002-06-06 |
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