HORIKAWA INDUSTRY CO., LTD.
Patent Applications and Registrations
Patent applications and USPTO patent grants for HORIKAWA INDUSTRY CO., LTD..The latest application filed is for "die set and working method using the die set".
- HORIKAWA INDUSTRY CO., LTD. - Komatsu N/A JP
- HORIKAWA INDUSTRY CO., LTD. - Komatsu-shi, Ishikawa JP
| Patent | Date |
|---|---|
| Die set and working method using the die set Grant 11,278,945 - Kato , et al. March 22, 2 | 2022-03-22 |
| Bending die for metal plate Grant D914,775 - Kato , et al. March 30, 2 | 2021-03-30 |
| Die Set And Working Method Using The Die Set App 20200038932 - Kato; Mitsunori ; et al. | 2020-02-06 |
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