Horiguchi; Akihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Horiguchi; Akihiro.The latest application filed is for "inter-network relay unit and transfer scheduling method in the same".

Company Profile

0.12.1

Horiguchi; Akihiro - Tokyo JP
Horiguchi; Akihiro - Fuchu JP
Horiguchi; Akihiro - Fujisawa JP
Horiguchi; Akihiro - Kanagawa-ken JP
Horiguchi; Akihiro - Kawasaki JP
Horiguchi; Akihiro - Yokohama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Inter-network relay system and method Grant 7,061,862 - Horiguchi , et al. June 13, 2	2006-06-13
Distributing ATM cells to output ports based upon destination information using ATM switch core and IP forwarding Grant 6,781,994 - Nogami , et al. August 24, 2	2004-08-24
Inter-network relay unit and transfer scheduling method in the same App 20020071387 - Horiguchi, Akihiro ; et al.	2002-06-13
Photovoltaic conversion element and a dye-sensitizing photovoltaic cell Grant 6,310,282 - Sakurai , et al. October 30, 2	2001-10-30
High thermal conductivity silicon nitride circuit substrate and semiconductor device using the same Grant 6,086,990 - Sumino , et al. July 11, 2	2000-07-11
ATM cell assembly and disassembly device with enhanced data handling flexibility Grant 5,541,926 - Saito , et al. July 30, 1	1996-07-30
Aluminum nitride sintered body, method for manufacturing the same, and ceramic circuit board Grant 5,409,869 - Ueno , et al. April 25, 1	1995-04-25
Method of manufacturing circuit board and circuit board itself manufactured by said method Grant 5,286,927 - Ueno , et al. February 15, 1	1994-02-15
Method of manufacturing circuit board Grant 5,184,399 - Ueno , et al. February 9, 1	1993-02-09
Method of manufacturing circuit board Grant 5,176,309 - Horiguchi , et al. January 5, 1	1993-01-05
Aluminum nitride sintered body and preparation thereof Grant 4,883,780 - Kasori , et al. November 28, 1	1989-11-28
AlN sintered body having high thermal conductivity and a method of fabricating the same Grant 4,847,221 - Horiguchi , et al. July 11, 1	1989-07-11
Aluminum nitride sintered body having conductive metallized layer Grant 4,770,953 - Horiguchi , et al. September 13, 1	1988-09-13

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