Horie; Hirotaka
Patent Applications and Registrations
Patent applications and USPTO patent grants for Horie; Hirotaka.The latest application filed is for "method for evaluating surface defects of substrate to be bonded".
- Horie; Hirotaka - Annaka JP
- HORIE; Hirotaka - Annaka-shi JP
| Patent | Date |
|---|---|
| Method for evaluating surface defects of substrate to be bonded Grant 10,707,140 - Sato , et al. | 2020-07-07 |
| Method For Evaluating Surface Defects Of Substrate To Be Bonded App 20190181059 - SATO; Kazuya ; et al. | 2019-06-13 |
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