Horibe; Hiroshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Horibe; Hiroshi.The latest application filed is for "semiconductor chip mounting apparatus and semiconductor chip mounting method".
- Horibe; Hiroshi - Tokyo JP
- Horibe; Hiroshi - Kanagawa JP
- Horibe; Hiroshi - Kawasaki JP
- Horibe; Hiroshi - Hyogo JP
| Patent | Date |
|---|---|
| Semiconductor chip mounting apparatus and semiconductor chip mounting method Grant 10,978,420 - Hagiwara , et al. April 13, 2 | 2021-04-13 |
| Semiconductor Chip Mounting Apparatus And Semiconductor Chip Mounting Method App 20200251441 - Kind Code | 2020-08-06 |
| Semiconductor device Grant 9,368,463 - Shin , et al. June 14, 2 | 2016-06-14 |
| Semiconductor device Grant 9,230,930 - Shin , et al. January 5, 2 | 2016-01-05 |
| Semiconductor device and a manufacturing method thereof Grant 9,230,937 - Sumitomo , et al. January 5, 2 | 2016-01-05 |
| Semiconductor Device App 20150228609 - Shin; Shiko ; et al. | 2015-08-13 |
| Semiconductor Device App 20140183734 - Shin; Shiko ; et al. | 2014-07-03 |
| Semiconductor device Grant 8,686,573 - Shin , et al. April 1, 2 | 2014-04-01 |
| Semiconductor Device App 20130234309 - Shin; Shiko ; et al. | 2013-09-12 |
| Method of manufacturing semiconductor device and semiconductor device Grant 8,415,245 - Takata , et al. April 9, 2 | 2013-04-09 |
| Semiconductor Device And A Manufacturing Method Thereof App 20120286427 - Sumitomo; Kaori ; et al. | 2012-11-15 |
| Method Of Manufacturing Semiconductor Device And Semiconductor Device App 20110057299 - TAKATA; Yasuki ; et al. | 2011-03-10 |
| Semiconductor device and method of manufacturing the same App 20070145583 - Matsuura; Masazumi ; et al. | 2007-06-28 |
| Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same Grant 7,202,565 - Matsuura , et al. April 10, 2 | 2007-04-10 |
| Semiconductor device Grant 7,138,725 - Horibe November 21, 2 | 2006-11-21 |
| Semiconductor device App 20050082659 - Horibe, Hiroshi | 2005-04-21 |
| Semiconductor device and method of manufacturing the same App 20050054188 - Matsuura, Masazumi ; et al. | 2005-03-10 |
| Semiconductor device and wire bonding apparatus App 20050029679 - Horibe, Hiroshi | 2005-02-10 |
| Semiconductor device App 20040262723 - Qin, Zhikang ; et al. | 2004-12-30 |
| Semiconductor device and wire bonding apparatus Grant 6,787,927 - Horibe September 7, 2 | 2004-09-07 |
| Semiconductor device Grant 6,600,218 - Aga , et al. July 29, 2 | 2003-07-29 |
| Semiconductor device App 20030052394 - Aga, Fumiaki ; et al. | 2003-03-20 |
| Semiconductor device and wire bonding apparatus App 20030042622 - Horibe, Hiroshi | 2003-03-06 |
| Semiconductor package Grant 6,518,652 - Takata , et al. February 11, 2 | 2003-02-11 |
| Semiconductor package App 20020027279 - Takata, Yasuki ; et al. | 2002-03-07 |
| Wire bonding method, wire bonding apparatus and semiconductor device produced by the same Grant 6,105,848 - Horibe , et al. August 22, 2 | 2000-08-22 |
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