HORIBE; AKIHIRO
Patent Applications and Registrations
Patent applications and USPTO patent grants for HORIBE; AKIHIRO.The latest application filed is for "underfill injection for electronic devices".
Company Profile
30.38.45
- HORIBE; AKIHIRO - Yokohama JP
- Horibe; Akihiro - Kanagawa-ken JP
- Horibe; Akihiro - Yokohama-shi JP
- Horibe; Akihiro - Kawasaki JP
- Horibe; Akihiro - Kanagawa JP
- Horibe; Akihiro - Aoba-ku JP
- Horibe; Akihiro - Yamato JP
- Horibe, Akihiro - Yamato-shi JP
Patent Activity
| Patent | Date |
|---|---|
| Underfill Injection For Electronic Devices App 20220238403 - HORIBE; AKIHIRO ; et al. | 2022-07-28 |
| Sampling of breath gas Grant 11,320,419 - Horibe , et al. May 3, 2 | 2022-05-03 |
| Stacked device structure Grant 11,316,143 - Horibe , et al. April 26, 2 | 2022-04-26 |
| Large capacity solid state battery Grant 11,211,638 - Horibe , et al. December 28, 2 | 2021-12-28 |
| Controlling Of Height Of High-density Interconnection Structure On Substrate App 20210343545 - Okamoto; Keishi ; et al. | 2021-11-04 |
| Solid-state Thin Film Battery For Microcomputing Devices App 20210320335 - Horibe; Akihiro | 2021-10-14 |
| Controlling of height of high-density interconnection structure on substrate Grant 11,114,308 - Okamoto , et al. September 7, 2 | 2021-09-07 |
| Sampling Of Breath Gas App 20210239679 - Horibe; Akihiro ; et al. | 2021-08-05 |
| Stacked film battery architecture Grant 11,069,917 - Horibe , et al. July 20, 2 | 2021-07-20 |
| Stacked film battery architecture Grant 11,063,288 - Horibe , et al. July 13, 2 | 2021-07-13 |
| Electron device stack structure Grant 10,903,526 - Sueoka , et al. January 26, 2 | 2021-01-26 |
| Stacked Device Structure App 20200358087 - Horibe; Akihiro ; et al. | 2020-11-12 |
| Wafer scale testing and initialization of small die chips Grant 10,679,912 - Horibe , et al. | 2020-06-09 |
| Circuit module and manufacturing method thereof Grant 10,679,916 - Horibe , et al. | 2020-06-09 |
| Electron Device Stack Structure App 20200176821 - Sueoka; Kuniaki ; et al. | 2020-06-04 |
| Picking up irregular semiconductor chips Grant 10,672,638 - Horibe , et al. | 2020-06-02 |
| High-density interconnecting adhesive tape Grant 10,622,311 - Horibe , et al. | 2020-04-14 |
| Controlling Of Height Of High-density Interconnection Structure On Substrate App 20200098592 - Okamoto; Keishi ; et al. | 2020-03-26 |
| Reduction of stress in via structure Grant 10,593,616 - Aoki , et al. | 2020-03-17 |
| High-density interconnecting adhesive tape Grant 10,529,665 - Horibe , et al. J | 2020-01-07 |
| Multi-chip package assembly Grant 10,460,971 - Horibe Oc | 2019-10-29 |
| Stacked Film Battery Architecture App 20190305355 - Horibe; Akihiro ; et al. | 2019-10-03 |
| Stacked film battery architecture Grant 10,431,847 - Horibe , et al. O | 2019-10-01 |
| Stacked Film Battery Architecture App 20190296387 - Horibe; Akihiro ; et al. | 2019-09-26 |
| Solder fill into high aspect through holes Grant 10,424,510 - Aoki , et al. Sept | 2019-09-24 |
| Wafer scale testing and initialization of small die chips Grant 10,388,578 - Horibe , et al. A | 2019-08-20 |
| Solder fill into high aspect through holes Grant 10,388,566 - Aoki , et al. A | 2019-08-20 |
| Reduction Of Stress In Via Structure App 20190214339 - Aoki; Toyohiro ; et al. | 2019-07-11 |
| Reduction of stress in via structure Grant 10,325,839 - Aoki , et al. | 2019-06-18 |
| Polymer waveguide (PWG) connector assembly having both cores and cladding partially exposed Grant 10,317,625 - Horibe , et al. | 2019-06-11 |
| Polymer waveguide connector assembly method using cores and cladding that are both partially exposed Grant 10,302,868 - Horibe , et al. | 2019-05-28 |
| Wafer Scale Testing And Initialization Of Small Die Chips App 20190139840 - Horibe; Akihiro ; et al. | 2019-05-09 |
| Forming a solder joint between metal layers Grant 10,252,363 - Aoki , et al. | 2019-04-09 |
| Wafer Scale Testing And Initialization Of Small Die Chips App 20190103327 - Horibe; Akihiro ; et al. | 2019-04-04 |
| Wafer Scale Testing And Initialization Of Small Die Chips App 20190103328 - Horibe; Akihiro ; et al. | 2019-04-04 |
| Single-mode Polymer Waveguide Connector Assembly App 20190072722 - Horibe; Akihiro ; et al. | 2019-03-07 |
| Single-mode Polymer Waveguide Connector Assembly App 20190072721 - Horibe; Akihiro ; et al. | 2019-03-07 |
| High-density Interconnecting Adhesive Tape App 20190051603 - Horibe; Akihiro ; et al. | 2019-02-14 |
| Large Capacity Solid State Battery App 20190051944 - Horibe; Akihiro ; et al. | 2019-02-14 |
| Large Capacity Solid State Battery App 20190051943 - Horibe; Akihiro ; et al. | 2019-02-14 |
| High-density Interconnecting Adhesive Tape App 20190051605 - Horibe; Akihiro ; et al. | 2019-02-14 |
| Debonding chips from wafer Grant 10,170,443 - Horibe J | 2019-01-01 |
| Circuit Module And Manufacturing Method Thereof App 20180366388 - HORIBE; Akihiro ; et al. | 2018-12-20 |
| Chip mounting structure Grant 10,141,278 - Horibe , et al. Nov | 2018-11-27 |
| Single-mode polymer waveguide connector assembly Grant 10,133,003 - Horibe , et al. November 20, 2 | 2018-11-20 |
| Single-mode polymer waveguide connector assembly Grant 10,107,966 - Horibe , et al. October 23, 2 | 2018-10-23 |
| Reduction Of Stress In Via Structure App 20180294214 - Aoki; Toyohiro ; et al. | 2018-10-11 |
| Reduction Of Stress In Via Structure App 20180294213 - Aoki; Toyohiro ; et al. | 2018-10-11 |
| Circuit module and manufacturing method thereof Grant 10,074,583 - Horibe , et al. September 11, 2 | 2018-09-11 |
| Picking Up Irregular Semiconductor Chips App 20180218952 - Horibe; Akihiro ; et al. | 2018-08-02 |
| Multi-chip Package Assembly App 20180096877 - Horibe; Akihiro | 2018-04-05 |
| Stacked Film Battery Architecture App 20180083304 - Horibe; Akihiro ; et al. | 2018-03-22 |
| Chip Mounting Structure App 20180076162 - HORIBE; Akihiro ; et al. | 2018-03-15 |
| Chip mounting structure Grant 9,893,031 - Horibe , et al. February 13, 2 | 2018-02-13 |
| Multi-chip package assembly Grant 9,887,119 - Horibe February 6, 2 | 2018-02-06 |
| Solder Fill Into High Aspect Through Holes App 20170338152 - Aoki; Toyohiro ; et al. | 2017-11-23 |
| Solder Fill Into High Aspect Through Holes App 20170263498 - Aoki; Toyohiro ; et al. | 2017-09-14 |
| Optical Device With Precoated Underfill App 20170148646 - Horibe; Akihiro ; et al. | 2017-05-25 |
| Optical Device With Precoated Underfill App 20170146741 - Horibe; Akihiro ; et al. | 2017-05-25 |
| Forming A Solder Joint Between Metal Layers App 20170120361 - Aoki; Toyohiro ; et al. | 2017-05-04 |
| Forming a solder joint between metal layers Grant 9,586,281 - Aoki , et al. March 7, 2 | 2017-03-07 |
| Method, apparatus, and structure for determining interposer thickness Grant 9,568,405 - Hada , et al. February 14, 2 | 2017-02-14 |
| Chip Mounting Structure App 20170005053 - HORIBE; Akihiro ; et al. | 2017-01-05 |
| Semiconductor structure including a through electrode, and method for forming the same Grant 9,466,533 - Horibe , et al. October 11, 2 | 2016-10-11 |
| Semiconductor structure including a through electrode, and method for forming the same Grant 9,373,545 - Horibe , et al. June 21, 2 | 2016-06-21 |
| Circuit Module And Manufacturing Method Thereof App 20160141218 - HORIBE; Akihiro ; et al. | 2016-05-19 |
| Semiconductor Structure Including A Through Electrode, And Method For Forming The Same App 20160099175 - Horibe; Akihiro ; et al. | 2016-04-07 |
| Forming A Solder Joint Between Metal Layers App 20160066435 - Aoki; Toyohiro ; et al. | 2016-03-03 |
| Semiconductor Structure Including A Through Electrode, And Method For Forming The Same App 20160056129 - Horibe; Akihiro ; et al. | 2016-02-25 |
| Prevention Of Warping During Handling Of Chip-on-wafer App 20150279812 - HORIBE; AKIHIRO ; et al. | 2015-10-01 |
| Prevention Of Warping During Handling Of Chip-on-wafer App 20150279790 - HORIBE; AKIHIRO ; et al. | 2015-10-01 |
| Prevention Of Warping During Handling Of Chip-on-wafer App 20150249064 - Horibe; Akihiro ; et al. | 2015-09-03 |
| Method, Apparatus, And Structure For Determining Interposer Thickness App 20150153406 - Hada; Sayuri ; et al. | 2015-06-04 |
| Solder Bonding Process Forming A Semiconductor Chip In Multiple Stages On A 3-dimensional Stacked Assembly App 20130105969 - Horibe; Akihiro | 2013-05-02 |
| Estimation Of Presence Of Void In Through Silicon Via (tsv) Based On Ultrasound Scanning App 20120304773 - Horibe; Akihiro ; et al. | 2012-12-06 |
| Multi Chip Stacking With Reliable Joining App 20100129961 - HORIBE; AKIHIRO ; et al. | 2010-05-27 |
| Alignment method for circular multi-core optical fiber Grant 7,548,674 - Horibe , et al. June 16, 2 | 2009-06-16 |
| Illuminator, liquid crystal display comprising it and lamp socket Grant 7,217,026 - Nishikai , et al. May 15, 2 | 2007-05-15 |
| Illuminator, liquid crystal display comprising it and lamp socket App 20040179152 - Nishikai, Akiko ; et al. | 2004-09-16 |
| Liquid crystal display device and display device Grant 6,765,634 - Horibe , et al. July 20, 2 | 2004-07-20 |
| Liquid crystal display device and display device App 20020126078 - Horibe, Akihiro ; et al. | 2002-09-12 |
| Tandem lighting panel Grant 6,241,358 - Higuchi , et al. June 5, 2 | 2001-06-05 |
| Light source device with uniformity in color temperature of emission Grant 6,217,184 - Koike , et al. April 17, 2 | 2001-04-17 |
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