loadpatents
name:-0.029471158981323
name:-0.016262054443359
name:-0.00066494941711426
Hori; Tetsuji Patent Filings

Hori; Tetsuji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hori; Tetsuji.The latest application filed is for "thin film magnetic head and manufacturing method thereof".

Company Profile
0.14.17
  • Hori; Tetsuji - Tokyo JP
  • HORI; Tetsuji - Iwakura-shi JP
  • Hori; Tetsuji - Kiyosu JP
  • Hori; Tetsuji - Saku-shi JP
  • Hori; Tetsuji - Kiyosu-shi JP
  • Hori; Tetsuji - Yokohama JP
  • Hori, Tetsuji - Aichi-ken JP
  • Hori; Tetsuji - Kanagawa JP
  • Hori, Tetsuji - Yokohama-shi JP
  • Hori; Tetsuji - Iwakura JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of making a mask, method of patterning by using this mask and method of manufacturing a micro-device
Grant 8,529,777 - Watanabe , et al. September 10, 2
2013-09-10
Thin Film Magnetic Head And Manufacturing Method Thereof
App 20130070364 - Matsuura; Yuji ;   et al.
2013-03-21
Method Of Making A Mask, Method Of Patterning By Using This Mask And Method Of Manufacturing A Micro-device
App 20130062307 - WATANABE; Hisayoshi ;   et al.
2013-03-14
Method of forming metal to a concave portion of a substrate, method of manufacturing a magnetic head and a magnetic head
Grant 8,379,346 - Watanabe , et al. February 19, 2
2013-02-19
Method Of Forming Metal To A Concave Portion Of A Substrate, Method Of Manufacturing A Magnetic Head And A Magnetic Head
App 20130027810 - WATANABE; Hisayoshi ;   et al.
2013-01-31
Polishing composition for polishing silver and alumina, and polishing method using the same
App 20110132868 - Hori; Tetsuji
2011-06-09
Retainer ring used for polishing a structure for manufacturing magnetic head, and polishing method using the same
Grant 7,867,060 - Aritomo , et al. January 11, 2
2011-01-11
Alumina-film-polishing composition and chemical mechanical polishing method using the same
Grant 7,699,901 - Hori April 20, 2
2010-04-20
Retainer ring used for polishing a structure for manufacturing magnetic head, and polishing method using the same
App 20090247060 - Aritomo; Hiroki ;   et al.
2009-10-01
Alumina-film-polishing composition and chemical mechanical polishing method using the same
App 20080293330 - Hori; Tetsuji
2008-11-27
Polishing Composition And Polishing Method Using The Same
App 20080214000 - ASANO; Hiroshi ;   et al.
2008-09-04
Composition for selectively polishing silicon nitride layer and polishing method employing it
Grant 7,217,989 - Hiramitsu , et al. May 15, 2
2007-05-15
Polishing composition and polishing method using same
App 20060258267 - Ito; Takashi ;   et al.
2006-11-16
Composition for selectively polishing silicon nitride layer and polishing method employing it
App 20060084270 - Hiramitsu; Ai ;   et al.
2006-04-20
Mounting material, semiconductor device and method of manufacturing semiconductor device
Grant 6,949,814 - Thai , et al. September 27, 2
2005-09-27
Polishing composition and polishing method using same
App 20040161937 - Asano, Hiroshi ;   et al.
2004-08-19
Solder material, device using the same and manufacturing process thereof
Grant 6,673,310 - Tadauchi , et al. January 6, 2
2004-01-06
Mounting material, semiconductor device and method of manufacturing semiconductor device
App 20030111728 - Thai, Cao Minh ;   et al.
2003-06-19
Semiconductor device
Grant D475,982 - Hori , et al. June 17, 2
2003-06-17
Semiconductor device
Grant D475,355 - Hori , et al. June 3, 2
2003-06-03
Semiconductor device
Grant D475,028 - Hori , et al. May 27, 2
2003-05-27
Semiconductor device
App 20030057573 - Sekine, Toshitaka ;   et al.
2003-03-27
Semiconductor Package And Manufacturing Method Thereof
App 20020140067 - Hori, Tetsuji
2002-10-03
Polishing composition
Grant 6,355,075 - Ina , et al. March 12, 2
2002-03-12
Solder material, device using the same and manufacturing process thereof
App 20010029095 - Tadauchi, Masahiro ;   et al.
2001-10-11
Semiconductor device provided with heat-sink and method of manufacturing the same
Grant 6,225,701 - Hori , et al. May 1, 2
2001-05-01

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