Hori; Teruo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hori; Teruo.The latest application filed is for "conjugated fiber and structural fiber product comprising the conjugated fiber".

Company Profile

0.7.6

Hori; Teruo - Fukui-shi JP
Hori; Teruo - Fukui JP
Hori, Teruo - Takatsuki-shi JP
Hori; Teruo - Toyonaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conjugated Fiber And Structural Fiber Product Comprising The Conjugated Fiber App 20140363653 - Hori; Teruo ; et al.	2014-12-11
Injection molding method with surface modification Grant 7,763,195 - Yusa , et al. July 27, 2	2010-07-27
Molded Article, Injection Molding Method And Apparatus App 20070166530 - Yusa; Atsushi ; et al.	2007-07-19
Injection molding method with surface modification Grant 7,211,207 - Yusa , et al. May 1, 2	2007-05-01
Injection molding method with surface modification Grant 6,955,781 - Yusa , et al. October 18, 2	2005-10-18
Molded article, injection molding method and apparatus App 20050175849 - Yusa, Atsushi ; et al.	2005-08-11
Dustproof clothing App 20040229540 - Akiba, Eiji ; et al.	2004-11-18
Molded article, injection molding method and apparatus App 20030228485 - Yusa, Atsushi ; et al.	2003-12-11
Polyurethane adhesive of epoxy resin, polyisocyanate, phosphorus oxy acid, and carboxylic acid Grant 5,202,391 - Yamazaki , et al. April 13, 1	1993-04-13
Polyurethane adhesive of epoxy resin, polyisocyanate, phosphorus oxy acid, and carboxylic acid Grant 5,096,980 - Yamazaki , et al. March 17, 1	1992-03-17
Heat adherable resin compositions and aluminum sheet laminated with the compositions Grant 4,828,920 - Nakabayashi , et al. May 9, 1	1989-05-09
Resin from saponified ethylene-vinyl acetate copolymers, production and use thereof Grant 4,614,781 - Hori , et al. September 30, 1	1986-09-30

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