loadpatents
name:-0.008091926574707
name:-0.0088748931884766
name:-0.00051212310791016
Hori; Kazumasa Patent Filings

Hori; Kazumasa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hori; Kazumasa.The latest application filed is for "high strength and high conductivity copper alloy rod or wire".

Company Profile
0.7.5
  • Hori; Kazumasa - Tokyo JP
  • Hori; Kazumasa - Osaka JP
  • Hori; Kazumasa - Sakai JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
High strength and high conductivity copper alloy rod or wire
Grant 10,163,539 - Oishi , et al. Dec
2018-12-25
High Strength And High Conductivity Copper Alloy Rod Or Wire
App 20170103825 - Oishi; Keiichiro ;   et al.
2017-04-13
High strength and high conductivity copper alloy rod or wire
Grant 9,512,506 - Oishi , et al. December 6, 2
2016-12-06
High Strength And High Conductivity Copper Alloy Rod Or Wire
App 20110100676 - Oishi; Keiichiro ;   et al.
2011-05-05
Method for manufacturing low-oxygen copper
Grant 7,524,356 - Asao , et al. April 28, 2
2009-04-28
Method for manufacturing low-oxygen copper
App 20050262968 - Asao, Haruhiko ;   et al.
2005-12-01
Method for manufacturing low-oxygen copper
Grant 6,944,930 - Asao , et al. September 20, 2
2005-09-20
Adhesion-resistant oxygen-free roughly drawn copper wire and method and apparatus for making the same
Grant 6,682,824 - Koshiba , et al. January 27, 2
2004-01-27
Method for manufacturing low-oxygen copper
App 20010029659 - Asao, Haruhiko ;   et al.
2001-10-18
Apparatus for manufacturing low-oxygen copper
App 20010028135 - Asao, Haruhiko ;   et al.
2001-10-11
Eddy current flaw detection apparatus employing a resonance circuit
Grant 5,146,164 - Masui , et al. September 8, 1
1992-09-08

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