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Patent applications and USPTO patent grants for Hori; Kazumasa.The latest application filed is for "high strength and high conductivity copper alloy rod or wire".
Patent | Date |
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High strength and high conductivity copper alloy rod or wire Grant 10,163,539 - Oishi , et al. Dec | 2018-12-25 |
High Strength And High Conductivity Copper Alloy Rod Or Wire App 20170103825 - Oishi; Keiichiro ;   et al. | 2017-04-13 |
High strength and high conductivity copper alloy rod or wire Grant 9,512,506 - Oishi , et al. December 6, 2 | 2016-12-06 |
High Strength And High Conductivity Copper Alloy Rod Or Wire App 20110100676 - Oishi; Keiichiro ;   et al. | 2011-05-05 |
Method for manufacturing low-oxygen copper Grant 7,524,356 - Asao , et al. April 28, 2 | 2009-04-28 |
Method for manufacturing low-oxygen copper App 20050262968 - Asao, Haruhiko ;   et al. | 2005-12-01 |
Method for manufacturing low-oxygen copper Grant 6,944,930 - Asao , et al. September 20, 2 | 2005-09-20 |
Adhesion-resistant oxygen-free roughly drawn copper wire and method and apparatus for making the same Grant 6,682,824 - Koshiba , et al. January 27, 2 | 2004-01-27 |
Method for manufacturing low-oxygen copper App 20010029659 - Asao, Haruhiko ;   et al. | 2001-10-18 |
Apparatus for manufacturing low-oxygen copper App 20010028135 - Asao, Haruhiko ;   et al. | 2001-10-11 |
Eddy current flaw detection apparatus employing a resonance circuit Grant 5,146,164 - Masui , et al. September 8, 1 | 1992-09-08 |
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