Hori; Haruo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hori; Haruo.The latest application filed is for "multi-layer capacitor, wiring board, and high-frequency circuit".

Company Profile

0.16.6

Hori; Haruo - Sabae JP
Hori, Haruo - Sabae-shi JP
Hori, Haruo - Sabac-shi JP
Hori; Haruo - Kurobe JP
Hori; Haruo - Hino JA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board Grant 7,215,531 - Naito , et al. May 8, 2	2007-05-08
Multi-layer capacitor, wiring board, and high-frequency circuit Grant 6,909,593 - Kuroda , et al. June 21, 2	2005-06-21
Multi-layer capacitor, wiring board, and high-frequency circuit App 20040223289 - Kuroda, Yoichi ; et al.	2004-11-11
Multi-layer capacitor, wiring board, and high-frequency circuit Grant 6,771,484 - Kuroda , et al. August 3, 2	2004-08-03
Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board App 20040140553 - Naito, Yasuyuki ; et al.	2004-07-22
Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board Grant 6,721,153 - Naito , et al. April 13, 2	2004-04-13
Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board Grant 6,678,145 - Naito , et al. January 13, 2	2004-01-13
Multi-layer capacitor, wiring board, and high-frequency circuit App 20030198006 - Kuroda, Yoichi ; et al.	2003-10-23
Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same Grant 6,606,237 - Naito , et al. August 12, 2	2003-08-12
Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board App 20030142460 - Naito, Yasuyuki ; et al.	2003-07-31
Multi-layer capacitor, wiring board, and high-frequency circuit Grant 6,594,136 - Kuroda , et al. July 15, 2	2003-07-15
Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board App 20020191366 - Naito, Yasuyuki ; et al.	2002-12-19
Multi-layer capacitor Grant 6,407,904 - Kuroda , et al. June 18, 2	2002-06-18
Multi-layer capacitor, wiring board, and high-frequency circuit App 20020071238 - Kuroda, Yoichi ; et al.	2002-06-13
Multi-layer capacitor, wiring board, and high-frequency circuit Grant 6,370,010 - Kuroda , et al. April 9, 2	2002-04-09
Multi-layer capacitor, wiring substrate, decoupling circuit, and high-frequency circuit Grant 6,351,369 - Kuroda , et al. February 26, 2	2002-02-26
Multi-layer capacitator, wiring substrate, decoupling circuit, and high-frequency circuit Grant 6,344,961 - Naito , et al. February 5, 2	2002-02-05
Multilayer capacitor, electronic device and high frequency circuit using the same Grant 6,331,930 - Kuroda , et al. December 18, 2	2001-12-18
Multi-layer capacitor, wiring board, and high-frequency circuit Grant 6,327,134 - Kuroda , et al. December 4, 2	2001-12-04
Monolithic capacitor Grant 6,038,121 - Naito , et al. March 14, 2	2000-03-14
Tiltable roller assembly Grant 4,282,631 - Uehara , et al. August 11, 1	1981-08-11
Method for developing an exposed silver halide color photosensitive material Grant 4,028,106 - Hori , et al. June 7, 1	1977-06-07

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