loadpatents
Patent applications and USPTO patent grants for Hooper; Stephen Ryan.The latest application filed is for "semiconductor device package having stress isolation and method therefor".
Patent | Date |
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Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide Grant 11,335,652 - Vincent , et al. May 17, 2 | 2022-05-17 |
Semiconductor Device Package Having Stress Isolation And Method Therefor App 20220068738 - Vincent; Michael B. ;   et al. | 2022-03-03 |
Shielded Electronic Package And Method Of Fabrication App 20220028766 - Lictao, JR.; Crispulo Estira ;   et al. | 2022-01-27 |
Grounding lids in integrated circuit devices Grant 11,127,645 - Daniels , et al. September 21, 2 | 2021-09-21 |
No-gel Pressure Sensor Package App 20210221671 - Hooper; Stephen Ryan ;   et al. | 2021-07-22 |
Package integrated waveguide Grant 11,031,681 - Vincent , et al. June 8, 2 | 2021-06-08 |
Method, System, and Apparatus for Forming Three-Dimensional Semiconductor Device Package with Waveguide App 20210035927 - Vincent; Michael B. ;   et al. | 2021-02-04 |
Media shield with EMI capability for pressure sensor Grant 10,892,229 - Hooper , et al. January 12, 2 | 2021-01-12 |
Grounding Lids In Integrated Circuit Devices App 20200402878 - DANIELS; Dwight Lee ;   et al. | 2020-12-24 |
Package Integrated Waveguide App 20200403298 - Vincent; Michael B. ;   et al. | 2020-12-24 |
Media Shield With Emi Capability For Pressure Sensor App 20200321286 - Hooper; Stephen Ryan ;   et al. | 2020-10-08 |
Press-fit semiconductor device Grant 10,790,220 - Saklang , et al. September 29, 2 | 2020-09-29 |
High aspect ratio connection for EMI shielding Grant 10,658,303 - Vincent , et al. | 2020-05-19 |
High Aspect Ratio Connection For Emi Shielding App 20200152579 - VINCENT; Michael B. ;   et al. | 2020-05-14 |
Press-fit Semicondcutor Device App 20200126895 - Saklang; Chayathorn ;   et al. | 2020-04-23 |
Sensor module with blade insert Grant 10,340,211 - Suwankasab , et al. | 2019-07-02 |
Devices and methods for testing integrated circuit devices Grant 9,818,656 - Schlarmann , et al. November 14, 2 | 2017-11-14 |
Method and structure for fabricating sensors with a sacrificial gel dome Grant 7,014,888 - McDonald , et al. March 21, 2 | 2006-03-21 |
Method and structure for fabricating sensors with a sacrificial gel dome App 20040118214 - McDonald, William G. ;   et al. | 2004-06-24 |
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