Hongo; Toshiaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hongo; Toshiaki.The latest application filed is for "planar antenna member and plasma processing apparatus including the same".

Company Profile

0.5.8

Hongo; Toshiaki - Hyogo JP
Hongo; Toshiaki - Hyogo-Ken JP
Hongo; Toshiaki - Amagasaki JP
Hongo; Toshiaki - Amagasaki-Shi JP
Hongo; Toshiaki - Nirasaki JP
Hongo, Toshiaki - Nirasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Plasma processing apparatus Grant 8,092,642 - Hongo , et al. January 10, 2	2012-01-10
Planar Antenna Member And Plasma Processing Apparatus Including The Same App 20110114021 - Ueda; Atsushi ; et al.	2011-05-19
Plasma processing method for forming a silicon nitride film on a silicon oxide film Grant 7,629,033 - Hongo , et al. December 8, 2	2009-12-08
Plasma Processing Apparatus App 20090214400 - Hongo; Toshiaki ; et al.	2009-08-27
Plasma processing apparatus having an evacuating arrangement to evacuate gas from gas-introducing part of a process chamber App 20070254113 - Hongo; Toshiaki ; et al.	2007-11-01
Plasma processing apparatus having an evacuating arrangement to evacuate gas from a gas-introducing part of a process chamber App 20070251453 - Hongo; Toshiaki ; et al.	2007-11-01
Plasma processing apparatus Grant 6,729,261 - Hongo May 4, 2	2004-05-04
Plasma processing apparatus Grant 6,656,322 - Hongo , et al. December 2, 2	2003-12-02
Plasma processing apparatus App 20020046808 - Hongo, Toshiaki ; et al.	2002-04-25
Plasma processing apparatus App 20020046807 - Hongo, Toshiaki	2002-04-25
Plasma processing apparatus with a dielectric plate having a thickness based on a wavelength of a microwave introduced into a process chamber through the dielectric plate Grant 6,372,084 - Hongo , et al. April 16, 2	2002-04-16
Plasma processing apparatus having an evacuating arrangement to evacuate gas from a gas-introducing part of a process chamber App 20020002948 - Hongo, Toshiaki ; et al.	2002-01-10
Plasma processing apparatus with a dielectric plate having a thickness based on a wavelength of a microwave introduced into a process chamber through the dielectric plate App 20010050059 - Hongo, Toshiaki ; et al.	2001-12-13

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