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Patent applications and USPTO patent grants for Hong; Yong-Sung.The latest application filed is for "wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same".
Patent | Date |
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Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same Grant 8,202,140 - Hong , et al. June 19, 2 | 2012-06-19 |
Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same App 20090068934 - Hong; Yong-Sung ;   et al. | 2009-03-12 |
CMP equipment for use in planarizing a semiconductor wafer Grant 6,899,609 - Hong May 31, 2 | 2005-05-31 |
CMP equipment for use in planarizing a semiconductor wafer App 20040087257 - Hong, Yong-Sung | 2004-05-06 |
Calibration device for pad conditioner head of a CMP machine App 20020137441 - Hong, Yong-Sung | 2002-09-26 |
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