loadpatents
name:-0.0092520713806152
name:-0.0078830718994141
name:-0.001093864440918
Hong; Yee Wei Eric Patent Filings

Hong; Yee Wei Eric

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hong; Yee Wei Eric.The latest application filed is for "thin chassis near field communication (nfc) antenna integration".

Company Profile
0.5.5
  • Hong; Yee Wei Eric - Santa Clara CA
  • Hong; Yee Wei Eric - Hayward CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Thin chassis near field communication (NFC) antenna integration
Grant 11,283,173 - Yang , et al. March 22, 2
2022-03-22
Thin chassis near field communication (NFC) antenna integration
Grant 10,749,261 - Yang , et al. A
2020-08-18
Thin Chassis Near Field Communication (nfc) Antenna Integration
App 20170264342 - Yang; Songnan ;   et al.
2017-09-14
Thin chassis near field communication (NFC) antenna integration
Grant 9,614,592 - Yang , et al. April 4, 2
2017-04-04
Thin Chassis Near Field Communication (nfc) Antenna Integration
App 20160191122 - Yang; Songnan ;   et al.
2016-06-30
Thin Chassis Near Field Communication (nfc) Antenna Integration
App 20160073221 - Yang; Songnan ;   et al.
2016-03-10
Thin chassis near field communication (NFC) antenna integration
Grant 9,083,073 - Yang , et al. July 14, 2
2015-07-14
Thin Chassis Near Field Communication (nfc) Antenna Integration
App 20140002313 - Yang; Songnan ;   et al.
2014-01-02

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