Hong; William Weilun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hong; William Weilun.The latest application filed is for "hotspot avoidance method for manufacturing integrated circuits".
Company Profile
12.20.25
- Hong; William Weilun - Hsinchu TW
- Hong; William Weilun - Hsinchu City TW
- Hong; William Weilun - Hsin-Chu TW
Patent Activity
| Patent | Date |
|---|---|
| Hotspot avoidance method for manufacturing integrated circuits Grant 11,443,095 - Liu , et al. September 13, 2 | 2022-09-13 |
| Hotspot Avoidance Method for Manufacturing Integrated Circuits App 20220012400 - Liu; I-Shuo ; et al. | 2022-01-13 |
| Post-cmp Cleaning Composition For Germanium- Containing Substrate App 20210371774 - CUI; Ji ; et al. | 2021-12-02 |
| Chemical mechanical planarization using nano-abrasive slurry Grant 11,189,497 - Nien , et al. November 30, 2 | 2021-11-30 |
| CMP System and Method of Use App 20210343538 - Hou; Te-Chien ; et al. | 2021-11-04 |
| Vias with metal caps for underlying conductive lines Grant 11,133,247 - Ho , et al. September 28, 2 | 2021-09-28 |
| Metal Heterojunction Structure With Capping Metal Layer App 20210272818 - LIN; Yi-Sheng ; et al. | 2021-09-02 |
| CMP slurry and CMP method Grant 11,094,555 - Hsu , et al. August 17, 2 | 2021-08-17 |
| Hard Mask Removal Method App 20210225657 - Tu; Che-Hao ; et al. | 2021-07-22 |
| CMP system and method of use Grant 11,069,533 - Hou , et al. July 20, 2 | 2021-07-20 |
| Metal heterojunction structure with capping metal layer Grant 11,037,799 - Lin , et al. June 15, 2 | 2021-06-15 |
| Hard mask removal method Grant 10,971,370 - Tu , et al. April 6, 2 | 2021-04-06 |
| CMP System and Method of Use App 20210020449 - Hou; Te-Chien ; et al. | 2021-01-21 |
| Chemical Mechanical Planarization Using Nano-abrasive Slurry App 20200365413 - Nien; Po-Chin ; et al. | 2020-11-19 |
| Cmp Slurry And Cmp Method App 20200279751 - Hsu; Chun-Wei ; et al. | 2020-09-03 |
| CMP slurry and CMP method Grant 10,692,732 - Hsu , et al. | 2020-06-23 |
| Methods for Reducing Scratch Defects in Chemical Mechanical Planarization App 20200126803 - Pan; Wan-Chun ; et al. | 2020-04-23 |
| Hard Mask Removal Method App 20200118827 - Tu; Che-Hao ; et al. | 2020-04-16 |
| Vias With Metal Caps For Underlying Conductive Lines App 20200105668 - Ho; Chia-Wei ; et al. | 2020-04-02 |
| Metal Heterojunction Structure With Capping Metal Layer App 20200098591 - Lin; Yi-Sheng ; et al. | 2020-03-26 |
| Cmp Slurry And Cmp Method App 20200098590 - Hsu; Chun-Wei ; et al. | 2020-03-26 |
| Planarization control in semiconductor manufacturing process Grant 10,541,139 - Nien , et al. Ja | 2020-01-21 |
| Methods for reducing scratch defects in chemical mechanical planarization Grant 10,522,365 - Pan , et al. Dec | 2019-12-31 |
| Hard mask removal method Grant 10,510,552 - Tu , et al. Dec | 2019-12-17 |
| Doped poly-silicon for PolyCMP planarity improvement Grant 10,068,988 - Hong , et al. September 4, 2 | 2018-09-04 |
| Hard Mask Removal Method App 20180240679 - Tu; Che-Hao ; et al. | 2018-08-23 |
| Doped Poly-silicon For Polycmp Planarity Improvement App 20180145152 - Hong; William Weilun ; et al. | 2018-05-24 |
| Hard mask removal method Grant 9,960,050 - Tu , et al. May 1, 2 | 2018-05-01 |
| Surface treatment in a chemical mechanical process Grant 9,941,109 - Liu , et al. April 10, 2 | 2018-04-10 |
| Asymmetric application of pressure to a wafer during a CMP process Grant 9,922,837 - Liu , et al. March 20, 2 | 2018-03-20 |
| Doped poly-silicon for polyCMP planarity improvement Grant 9,871,115 - Hong , et al. January 16, 2 | 2018-01-16 |
| Surface Treatment in a Chemical Mechanical Process App 20180005840 - Liu; Chih-Wen ; et al. | 2018-01-04 |
| Doped Poly-Silicon for PolyCMP Planarity Improvement App 20180006134 - Hong; William Weilun ; et al. | 2018-01-04 |
| Planarization Control in Semiconductor Manufacturing Process App 20170278712 - Nien; Po-Chin ; et al. | 2017-09-28 |
| Asymmetric Application of Pressure to a Wafer During a CMP Process App 20170256414 - Liu; Chih-Wen ; et al. | 2017-09-07 |
| Method and apparatus for semiconductor planarization Grant 9,721,831 - Nien , et al. August 1, 2 | 2017-08-01 |
| Methods for Reducing Scratch Defects in Chemical Mechanical Planarization App 20170213743 - Pan; Wan-Chun ; et al. | 2017-07-27 |
| Mechanisms for forming oxide layer over exposed polysilicon during a chemical mechanical polishing (CMP) process Grant 9,711,374 - Tu , et al. July 18, 2 | 2017-07-18 |
| Method and Apparatus for Semiconductor Planarization App 20170162432 - Nien; Po-Chin ; et al. | 2017-06-08 |
| Composite structure for gate level inter-layer dielectric Grant 9,595,450 - Tu , et al. March 14, 2 | 2017-03-14 |
| CMP slurry particle breakup Grant 9,278,423 - Hong , et al. March 8, 2 | 2016-03-08 |
| Composite Structure for Gate Level Inter-Layer Dielectric App 20150187594 - Tu; Che-Hao ; et al. | 2015-07-02 |
| CMP Slurry Particle Breakup App 20150099431 - Hong; William Weilun ; et al. | 2015-04-09 |
| Hard Mask Removal Method App 20150037978 - TU; CHE-HAO ; et al. | 2015-02-05 |
| Mechanisms For Forming Oxide Layer Over Exposed Polysilicon During A Chemical Mechanical Polishing (cmp) Process App 20140370696 - TU; Che-Hao ; et al. | 2014-12-18 |
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