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Patent applications and USPTO patent grants for Hong; Vu A..The latest application filed is for "haptic actuator including thermally coupled heat spreading layer and related methods".
Patent | Date |
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Haptic actuator including thermally coupled heat spreading layer and related methods Grant 10,886,821 - Larson , et al. January 5, 2 | 2021-01-05 |
Tungsten frame of a haptic feedback module for a portable electronic device Grant 10,831,276 - Cincione , et al. November 10, 2 | 2020-11-10 |
Haptic Actuator Including Thermally Coupled Heat Spreading Layer And Related Methods App 20200212766 - LARSON; Nils E. ;   et al. | 2020-07-02 |
Tungsten Frame Of A Haptic Feedback Module For A Portable Electronic Device App 20200081540 - CINCIONE; Dominic P. ;   et al. | 2020-03-12 |
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