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Patent applications and USPTO patent grants for HONG; Sung-Tae.The latest application filed is for "electrically assisted pressure joining apparatus and electrically assisted pressure joining method".
Patent | Date |
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Electrically Assisted Pressure Joining Apparatus And Electrically Assisted Pressure Joining Method App 20210394298 - HONG; Sung-Tae ;   et al. | 2021-12-23 |
Method Of Joining High Entropy Alloy, Apparatus For Joining High Entropy Alloy, And Joined Structure Of High Entropy Alloy App 20210245283 - HAN; Heung Nam ;   et al. | 2021-08-12 |
Apparatus For Heat-treating Waste Matters App 20150014143 - Hong; Sung Tae ;   et al. | 2015-01-15 |
Method and apparatus for measuring a base station's performance in a mobile communication system Grant 6,453,152 - Hong , et al. September 17, 2 | 2002-09-17 |
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