Hong; Sung Jae

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hong; Sung Jae.The latest application filed is for "lead-free solder, solder paste and semiconductor device".

Company Profile

0.9.8

Hong; Sung Jae - Gyeonggi-do N/A KR
Hong; Sung Jae - Yongin-si KR
Hong; Sung Jae - Seongnam N/A KR
Hong; Sung Jae - Seongnam-City KR
Hong; Sung Jae - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal organic chemical vapor deposition device and temperature control method therefor Grant 9,165,808 - Hong October 20, 2	2015-10-20
Lead free solder bumps Grant 9,156,111 - Hong , et al. October 13, 2	2015-10-13
Temperature control method of chemical vapor deposition device Grant 9,070,726 - Hong June 30, 2	2015-06-30
Lead-free Solder, Solder Paste And Semiconductor Device App 20150151386 - HONG; Sung Jae ; et al.	2015-06-04
Tin-based Solder Ball And Semiconductor Package Including The Same App 20140284794 - Lee; Jae Hong ; et al.	2014-09-25
Tin-based solder ball and semiconductor package including the same Grant 8,716,860 - Lee , et al. May 6, 2	2014-05-06
Tin-based Solder Ball And Semiconductor Package Including The Same App 20130175688 - LEE; Young Woo ; et al.	2013-07-11
Temperature control method for chemical vapor deposition apparatus Grant 8,481,102 - Hong , et al. July 9, 2	2013-07-09
Chemical Vapor Deposition Device And Temperature Control Method Of Chemical Vapor Deposition Device App 20120216747 - Hong; Sung Jae	2012-08-30
Metal Organic Chemical Vapor Deposition Device And Temperature Control Method Therefor App 20120221138 - Hong; Sung Jae	2012-08-30
Temperature Control Method Of Chemical Vapor Deposition Device App 20120221167 - Hong; Sung Jae	2012-08-30
Temperature Control Method For Chemical Vapor Deposition Apparatus App 20110143016 - Hong; Sung Jae ; et al.	2011-06-16
Gold alloy bonding wire for semiconductor device Grant 6,991,854 - Cho , et al. January 31, 2	2006-01-31
Gold alloy bonding wire for semiconductor device App 20040202568 - Cho, Jong Soo ; et al.	2004-10-14

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