Hong; Suk Kee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hong; Suk Kee.The latest application filed is for "mems module package using sealing cap having heat releasing capability and manufacturing method thereof".

Company Profile

0.9.14

Hong; Suk Kee - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same Grant 7,443,024 - Hong , et al. October 28, 2	2008-10-28
Optical modulator module package using flip-chip mounting technology Grant 7,394,139 - Park , et al. July 1, 2	2008-07-01
Micro-electro-mechanical system (MEMS) package having hydrophobic layer Grant 7,388,282 - Lee , et al. June 17, 2	2008-06-17
Micro-electro-mechanical system (MEMS) package having metal sealing member Grant 7,368,816 - Lim , et al. May 6, 2	2008-05-06
Optical modulator module package structure Grant 7,319,553 - Hong January 15, 2	2008-01-15
MEMS module package using sealing cap having heat releasing capability and manufacturing method thereof App 20070075417 - Hwang; Young-Nam ; et al.	2007-04-05
Optical modulator module package structure App 20060222313 - Hong; Suk Kee	2006-10-05
Microelectromechanical systems (MEMS) variable optical attenuator Grant 7,113,689 - Hong , et al. September 26, 2	2006-09-26
Optical modulator module package using flip-chip mounting technology App 20060198000 - Park; Heung Woo ; et al.	2006-09-07
Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same Grant 7,078,804 - Hong , et al. July 18, 2	2006-07-18
Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same App 20060081951 - Hong; Suk Kee ; et al.	2006-04-20
Micro-electro-mechanical system (MEMS) package having hydrophobic layer App 20060076666 - Lee; Yeong Gyu ; et al.	2006-04-13
Package structure for optical modulator App 20060078247 - Lee; Yeong Gyu ; et al.	2006-04-13
Micro-electro-mechanical system (MEMS) package having metal sealing member App 20060076670 - Lim; Ohk Kun ; et al.	2006-04-13
Micro-electro-mechanical system (MEMS) package with spacer for sealing and method of manufacturing the same App 20050275075 - Hong, Suk-Kee ; et al.	2005-12-15
Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same App 20050258516 - Hong, Suk-Kee ; et al.	2005-11-24
Multi-channel optical switch and method for manufacturing the same Grant 6,915,033 - Hong , et al. July 5, 2	2005-07-05
Microelectromechanical system (MEMS) variable optical attenuator Grant 6,901,204 - Hong , et al. May 31, 2	2005-05-31
Wavelength division multiplexing system having built-in optical attenuator App 20050084205 - Hong, Suk Kee ; et al.	2005-04-21
Micro optical communication device package App 20050078920 - Lee, Yeong Gyu ; et al.	2005-04-14
Multi-channel optical switch and method for manufacturing the same App 20040264849 - Hong, Suk Kee ; et al.	2004-12-30
Microelectromechanical system (MEMS) variable optical attenuator App 20040126081 - Hong, Yoon Shik ; et al.	2004-07-01
Microelectromechanical systems (MEMS) variable optical attenuator App 20040126080 - Hong, Yoon Shik ; et al.	2004-07-01

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