Hong; Sam-Hyo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hong; Sam-Hyo.The latest application filed is for "highly reliable, cost effective and thermally enhanced ausn die-attach technology".
- Hong; Sam-Hyo - Spanga SE
| Patent | Date |
|---|---|
| Highly reliable, cost effective and thermally enhanced AuSn die-attach technology Grant 7,608,485 - Hong , et al. October 27, 2 | 2009-10-27 |
| Highly reliable, cost effective and thermally enhanced AuSn die-attach technology App 20070181987 - Hong; Sam-Hyo ; et al. | 2007-08-09 |
| Integrated Circuit Components Thereof And Manufacturing Method App 20020132439 - NORSTROM, HANS ERIK ; et al. | 2002-09-19 |
| Integrated circuit, components thereof and manufacturing method Grant 6,406,972 - Norstrom , et al. June 18, 2 | 2002-06-18 |
| Integrated circuit, components thereof and manufacturing method App 20010021559 - Norstrom, Hans Erik ; et al. | 2001-09-13 |
| Electromigration resistant metallization structures for microcircuit interconnections with RF-reactively sputtered titanium tungsten and gold Grant 5,821,620 - Hong October 13, 1 | 1998-10-13 |
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