HONG; Myeong Ho

Patent Applications and Registrations

Patent applications and USPTO patent grants for HONG; Myeong Ho.The latest application filed is for "semiconductor package substrate and method of manufacturing semiconductor package using the same".

Company Profile

1.7.17

HONG; Myeong Ho - Suwon-si KR
HONG; Myeong Ho - Changwon-si KR
HONG; MYEONG HO - CHANGWON KR
Hong; Myeong Ho - Gyunggi-do KR
Hong; Myeong Ho - Gyeongsangnam-do KR
Hong; Myeong Ho - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package Substrate And Method Of Manufacturing Semiconductor Package Using The Same App 20210375805 - KO; Tae Ho ; et al.	2021-12-02
Semiconductor package substrate and method of manufacturing semiconductor package using the same Grant 11,114,397 - Ko , et al. September 7, 2	2021-09-07
Semiconductor Package Substrate And Method Of Manufacturing Semiconductor Package Using The Same App 20200312801 - KO; Tae Ho ; et al.	2020-10-01
Fan-out semiconductor package Grant 10,026,681 - Ko , et al. July 17, 2	2018-07-17
Fan-out Semiconductor Package App 20180082933 - KO; Tae Ho ; et al.	2018-03-22
Method For Manufacturing Substrate For Package App 20150198888 - LEE; Chang Bo ; et al.	2015-07-16
Printed Circuit Board And Manufacturing Method Thereof App 20150053456 - LEE; CHANG BO ; et al.	2015-02-26
Method for manufacturing printed circuit board including flame retardant insulation layer Grant 8,840,967 - Cho , et al. September 23, 2	2014-09-23
Method Of Manufacturing Coreless Substrate App 20120324723 - Hong; Myeong Ho ; et al.	2012-12-27
Method for manufacturing printed circuit board using imprinting Grant 8,216,503 - Cho , et al. July 10, 2	2012-07-10
Method for manufacturing substrate by imprinting Grant 8,187,518 - Lee , et al. May 29, 2	2012-05-29
Method Of Manufacturing Circuit Board App 20120111728 - Cho; Suk Hyeon ; et al.	2012-05-10
Method For Manufacturing Printed Circuit Board Including Flame Retardant Insulation Layer App 20120064231 - Cho; Jae-Choon ; et al.	2012-03-15
Manufacturing method of printed circuit board using an ink jet Grant 7,653,990 - Lee , et al. February 2, 2	2010-02-02
Printed circuit board App 20090183903 - Lee; Choon-Keun ; et al.	2009-07-23
Flame retardant resin composition for printed circuit board and printed circuit board using the same App 20080090084 - Cho; Jae-Choon ; et al.	2008-04-17
Method of manufacturing a stamper App 20080054518 - RA; Seung-Hyun ; et al.	2008-03-06
Manufacturing method of printed circuit board App 20080016686 - Lee; Choon-Keun ; et al.	2008-01-24
Method for manufacturing printed circuit board App 20080012168 - Ra; Senug-Hyun ; et al.	2008-01-17
Method for manufacturing printed circuit board using imprinting App 20080008824 - Cho; Jae-Choon ; et al.	2008-01-10
Method for manufacturing substrate by imprinting App 20070207297 - Lee; Choon-Keun ; et al.	2007-09-06
Method of fabricating printed circuit board using imprinting process App 20070020397 - Cho; Jae Choon ; et al.	2007-01-25
Imprinting mold for printed circuit board having excellent durability and method of manufacturing printed circuit board using the same App 20060222833 - Maeng; Il Sang ; et al.	2006-10-05

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