loadpatents
Patent applications and USPTO patent grants for Hong; Min Hao.The latest application filed is for "method of using a polishing system".
Patent | Date |
---|---|
Method of using a polishing system Grant 11,358,252 - Lin , et al. June 14, 2 | 2022-06-14 |
Apparatus and method for processing wafer Grant 10,861,721 - Chou , et al. December 8, 2 | 2020-12-08 |
Method Of Using A Polishing System App 20190337116 - LIN; Shih-Chi ;   et al. | 2019-11-07 |
Polishing system Grant 10,357,867 - Lin , et al. July 23, 2 | 2019-07-23 |
Apparatus And Method For Processing Wafer App 20190172735 - CHOU; You-Hua ;   et al. | 2019-06-06 |
Apparatus and method for processing wafer Grant 10,204,807 - Chou , et al. Feb | 2019-02-12 |
Apparatus And Method For Processing Wafer App 20180308724 - CHOU; You-Hua ;   et al. | 2018-10-25 |
Polishing System App 20170312881 - LIN; Shih-Chi ;   et al. | 2017-11-02 |
Image sensor isolation region and method of forming the same Grant 9,786,707 - JangJian , et al. October 10, 2 | 2017-10-10 |
Polishing system and polishing method Grant 9,718,164 - Lin , et al. August 1, 2 | 2017-08-01 |
Image sensor isolation region and method of forming the same Grant 9,673,244 - JangJian , et al. June 6, 2 | 2017-06-06 |
Reverse damascene process Grant 9,607,946 - Chou , et al. March 28, 2 | 2017-03-28 |
Reverse damascene process Grant 9,536,834 - Chou , et al. January 3, 2 | 2017-01-03 |
Two-step shallow trench isolation (STI) process Grant 9,502,280 - Hong , et al. November 22, 2 | 2016-11-22 |
Grids in backside illumination image sensor chips and methods for forming the same Grant 9,478,581 - JangJian , et al. October 25, 2 | 2016-10-25 |
CIS image sensors with epitaxy layers and methods for forming the same Grant 9,368,540 - JangJian , et al. June 14, 2 | 2016-06-14 |
Grids in Backside Illumination Image Sensor Chips and Methods for Forming the Same App 20160155771 - JangJian; Shiu-Ko ;   et al. | 2016-06-02 |
System and method for reducing irregularities on the surface of a backside illuminated photodiode Grant 9,349,902 - JangJian , et al. May 24, 2 | 2016-05-24 |
Grids in backside illumination image sensor chips and methods for forming the same Grant 9,257,476 - JangJian , et al. February 9, 2 | 2016-02-09 |
Mechanisms for forming semiconductor device having stable dislocation profile Grant 9,214,514 - Hong , et al. December 15, 2 | 2015-12-15 |
Grids in Backside Illumination Image Sensor Chips and Methods for Forming the Same App 20150236067 - JangJian; Shiu-Ko ;   et al. | 2015-08-20 |
Two-Step Shallow Trench Isolation (STI) Process App 20150179502 - Hong; Min Hao ;   et al. | 2015-06-25 |
Grids in backside illumination image sensor chips and methods for forming the same Grant 9,041,140 - JangJian , et al. May 26, 2 | 2015-05-26 |
Mechanisms For Forming Semiconductor Device Having Stable Dislocation Profile App 20150132913 - HONG; Min-Hao ;   et al. | 2015-05-14 |
Two-step shallow trench isolation (STI) process Grant 9,006,070 - Hong , et al. April 14, 2 | 2015-04-14 |
CIS Image Sensors with Epitaxy Layers and Methods for Forming the Same App 20150041851 - JangJian; Shiu-Ko ;   et al. | 2015-02-12 |
CIS image sensors with epitaxy layers and methods for forming the same Grant 8,889,461 - JangJian , et al. November 18, 2 | 2014-11-18 |
Method and apparatus for preparing polysilazane on a semiconductor wafer Grant 8,796,105 - Chou , et al. August 5, 2 | 2014-08-05 |
Method and apparatus for backside illumination sensor Grant 8,772,899 - JangJian , et al. July 8, 2 | 2014-07-08 |
Two-step Shallow Trench Isolation (sti) Process App 20140179071 - Hong; Min Hao ;   et al. | 2014-06-26 |
Polishing System And Polishing Method App 20140162534 - LIN; Shih-Chi ;   et al. | 2014-06-12 |
Two-step shallow trench isolation (STI) process Grant 8,692,299 - Hong , et al. April 8, 2 | 2014-04-08 |
Two-step Shallow Trench Isolation (sti) Process App 20140054653 - Hong; Min Hao ;   et al. | 2014-02-27 |
Method And Apparatus For Preparing Polysilazane On A Semiconductor Wafer App 20140030866 - Chou; You-Hua ;   et al. | 2014-01-30 |
Reverse Damascene Process App 20130328198 - Chou; You-Hua ;   et al. | 2013-12-12 |
CIS Image Sensors with Epitaxy Layers and Methods for Forming the Same App 20130320419 - JangJian; Shiu-Ko ;   et al. | 2013-12-05 |
System and Method for Processing a Backside Illuminated Photodiode App 20130320478 - JangJian; Shiu-Ko ;   et al. | 2013-12-05 |
Image Sensor Isolation Region and Method of Forming the Same App 20130280849 - JangJian; Shiu-Ko ;   et al. | 2013-10-24 |
Reverse Damascene Process App 20130260552 - Chou; You-Hua ;   et al. | 2013-10-03 |
Grids in Backside Illumination Image Sensor Chips and Methods for Forming the Same App 20130241018 - JangJian; Shiu-Ko ;   et al. | 2013-09-19 |
Image Sensor Isolation Region and Method of Forming the Same App 20130234202 - JangJian; Shiu-Ko ;   et al. | 2013-09-12 |
Method and Apparatus for Backside Illumination Sensor App 20130228886 - JangJian; Shiu-Ko ;   et al. | 2013-09-05 |
Reverse damascene process Grant 8,518,818 - Chou , et al. August 27, 2 | 2013-08-27 |
Stressed semiconductor device and method of manufacturing Grant 8,455,883 - Liao , et al. June 4, 2 | 2013-06-04 |
Reverse Damascene Process App 20130069233 - Chou; You-Hua ;   et al. | 2013-03-21 |
Stressed Semiconductor Device And Method Of Manufacturing App 20120292639 - Liao; Miao-Cheng ;   et al. | 2012-11-22 |
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