loadpatents
Patent applications and USPTO patent grants for Hong; JiSun.The latest application filed is for "package substrates".
Patent | Date |
---|---|
Package substrates Grant 10,256,181 - Kim , et al. | 2019-04-09 |
Package Substrates App 20180315698 - Kim; JinGyu ;   et al. | 2018-11-01 |
Package substrates Grant 10,032,706 - Kim , et al. July 24, 2 | 2018-07-24 |
Package Substrates App 20170077041 - KIM; JinGyu ;   et al. | 2017-03-16 |
Semiconductor device and method of manufacturing the same Grant 9,112,062 - Hong , et al. August 18, 2 | 2015-08-18 |
Semiconductor Device And Method Of Manufacturing The Same App 20140117506 - HONG; JiSun ;   et al. | 2014-05-01 |
Method for wafer level package and semiconductor device fabricated using the same Grant 8,558,371 - Hong , et al. October 15, 2 | 2013-10-15 |
Method For Wafer Level Package and Semiconductor Device Fabricated Using The Same App 20110233706 - Hong; JiSun ;   et al. | 2011-09-29 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.