Hong; Jiseok

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hong; Jiseok.The latest application filed is for "die-to-wafer bonding structure and semiconductor package using the same".

Company Profile

9.7.13

Hong; Jiseok - Yongin-si KR
Hong; Jiseok - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package including underfill material layer and method of forming the same Grant 11,404,395 - Hwang , et al. August 2, 2	2022-08-02
Die-to-wafer Bonding Structure And Semiconductor Package Using The Same App 20220181285 - Hong; Jiseok ; et al.	2022-06-09
Semiconductor Package Having Stacked Semiconductor Chips App 20220130801 - LEE; Hyuekjae ; et al.	2022-04-28
Die-to-wafer bonding structure and semiconductor package using the same Grant 11,289,438 - Hong , et al. March 29, 2	2022-03-29
Semiconductor Packages And Methods Of Manufacturing The Same App 20220068863 - HONG; JISEOK ; et al.	2022-03-03
Semiconductor device including a passivation spacer and method of fabricating the same Grant 11,251,070 - Hong , et al. February 15, 2	2022-02-15
Semiconductor package having stacked semiconductor chips Grant 11,244,927 - Lee , et al. February 8, 2	2022-02-08
Semiconductor Memory Device App 20220020758 - PARK; SEORYONG ; et al.	2022-01-20
Integrated Circuit Device App 20210398569 - Hong; Jiseok ; et al.	2021-12-23
Integrated Circuit Device App 20210391259 - Ahn; Jiyoung ; et al.	2021-12-16
Semiconductor packages having improved reliability in bonds between connection conductors and pads Grant 11,158,594 - Hong , et al. October 26, 2	2021-10-26
Semiconductor Package Including Underfill Material Layer And Method Of Forming The Same App 20210151410 - HWANG; Jihwan ; et al.	2021-05-20
Semiconductor Packages And Methods Of Manufacturing The Same App 20210143116 - HONG; JISEOK ; et al.	2021-05-13
Die-to-wafer Bonding Structure And Semiconductor Package Using The Same App 20210104482 - Hong; Jiseok ; et al.	2021-04-08
Semiconductor Package Having Stacked Semiconductor Chips App 20210028152 - LEE; Hyuekjae ; et al.	2021-01-28
Semiconductor Device Including A Passivation Spacer And Method Of Fabricating The Same App 20210005509 - HONG; JISEOK ; et al.	2021-01-07
Semiconductor device including a passivation spacer and method of fabricating the same Grant 10,790,186 - Hong , et al. September 29, 2	2020-09-29
Semiconductor device Grant 10,410,916 - Hong , et al. Sept	2019-09-10
Semiconductor Device App 20190221475 - HONG; Jiseok ; et al.	2019-07-18
Semiconductor Device Including A Passivation Spacer And Method Of Fabricating The Same App 20190122919 - HONG; JISEOK ; et al.	2019-04-25

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