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Patent applications and USPTO patent grants for HONG; Ji Su.The latest application filed is for "multilayer ceramic electronic component".
Patent | Date |
---|---|
Multilayer Ceramic Electronic Component App 20220270824 - AN; Hyeg Soon ;   et al. | 2022-08-25 |
Ceramic Electronic Component App 20220230810 - Hong; Ji Su ;   et al. | 2022-07-21 |
Multilayer Capacitor App 20220208455 - NAM; Hong Gi ;   et al. | 2022-06-30 |
Apparatus And Method For Processing Substrate App 20220206399 - Kwon; Oh Jin ;   et al. | 2022-06-30 |
Dielectric Composition And Multilayer Electronic Component Including The Same App 20220181080 - CHUN; Hee Sun ;   et al. | 2022-06-09 |
Multilayer Electronic Component App 20220157530 - Kim; Hyoung Uk ;   et al. | 2022-05-19 |
Multilayer Capacitor App 20220139625 - LEE; Je Hee ;   et al. | 2022-05-05 |
Wafer Type Sensor Unit And Data Acquisition Method Using The Wafer Type Sensor Unit App 20220091150 - SEO; Yong-Jun ;   et al. | 2022-03-24 |
Surface Treatment Apparatus And Surface Treatment Method App 20210159092 - GOH; Jung Suk ;   et al. | 2021-05-27 |
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