Hong; Heng Wan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hong; Heng Wan.The latest application filed is for "electronic component".
- Hong; Heng Wan - Singapore N/A SG
| Patent | Date |
|---|---|
| Electronic component employing a layered frame Grant 8,703,544 - Li , et al. April 22, 2 | 2014-04-22 |
| Electronic Component App 20120156832 - Li; Wu Hu ; et al. | 2012-06-21 |
| Electronic component with layered frame Grant 8,125,060 - Li , et al. February 28, 2 | 2012-02-28 |
| Lead frame Grant RE41,510 - Hong , et al. August 17, 2 | 2010-08-17 |
| Electronic component App 20080135995 - Li; Wu Hu ; et al. | 2008-06-12 |
| Lead frame Grant 7,193,298 - Hong , et al. March 20, 2 | 2007-03-20 |
| Lead frame App 20050056914 - Hong, Heng Wan ; et al. | 2005-03-17 |
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