Hong; Harry Kam Cheng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hong; Harry Kam Cheng.The latest application filed is for "locking of mold compound to conductive substrate panels".
- Hong; Harry Kam Cheng - Melaka MY
| Patent | Date |
|---|---|
| Locking of mold compound to conductive substrate panels Grant 6,963,124 - Hong , et al. November 8, 2 | 2005-11-08 |
| Leadless leadframe package design that provides a greater structural integrity Grant 6,933,174 - Hong , et al. August 23, 2 | 2005-08-23 |
| Leadless leadframe package design that provides a greater structural integrity Grant 6,818,970 - Hong , et al. November 16, 2 | 2004-11-16 |
| Locking of mold compound to conductive substrate panels Grant 6,808,961 - Hong , et al. October 26, 2 | 2004-10-26 |
| Leadless leadframe package design that provides a greater structural integrity Grant 6,677,667 - Hong , et al. January 13, 2 | 2004-01-13 |
| Rotary mechanical buffing method for deflashing of molded integrated circuit packages Grant 6,629,880 - Kang , et al. October 7, 2 | 2003-10-07 |
| Pin indicator for leadless leadframe packages Grant 6,448,107 - Hong , et al. September 10, 2 | 2002-09-10 |
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