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Patent applications and USPTO patent grants for Hong; Gi-Sik.The latest application filed is for "cmp slurry composition for polishing an organic layer and method of forming a semiconductor device using the same".
Patent | Date |
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CMP slurry composition for polishing an organic layer and method of forming a semiconductor device using the same Grant 9,343,326 - Kim , et al. May 17, 2 | 2016-05-17 |
Cmp Slurry Composition For Polishing An Organic Layer And Method Of Forming A Semiconductor Device Using The Same App 20150348798 - KIM; Yun-Jeong ;   et al. | 2015-12-03 |
Cmp Slurry Composition For Polishing An Organic Layer And Method Of Forming A Semiconductor Device Using The Same App 20150021513 - KIM; Yun-Jeong ;   et al. | 2015-01-22 |
Slurry compositions and methods of polishing a layer using the slurry compositions Grant 8,314,028 - Hong , et al. November 20, 2 | 2012-11-20 |
Pad Conditioner Of Semiconductor Wafer Polishing Apparatus And Manufacturing Method Thereof App 20090042494 - Moon; Sung-Taek ;   et al. | 2009-02-12 |
Slurry Compositions And Methods Of Polishing A Layer Using The Slurry Compositions App 20080081542 - HONG; Gi-Sik ;   et al. | 2008-04-03 |
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