Hong; Chang Seob
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hong; Chang Seob.The latest application filed is for "power module package".
- Hong; Chang Seob - Suwon-Si KR
- Hong; Chang Seob - Suwon KR
- Hong; Chang Seob - Gyunggi-do KR
| Patent | Date |
|---|---|
| Power semiconductor module Grant 9,443,818 - Kim , et al. September 13, 2 | 2016-09-13 |
| Heat radiating substrate and method of manufacturing the same Grant 9,258,879 - Lee , et al. February 9, 2 | 2016-02-09 |
| Power Module Package App 20150270217 - KIM; Kwang Soo ; et al. | 2015-09-24 |
| External connection terminal, semiconductor package having external connection terminal, and methods for manufacturing the same Grant 9,105,616 - Hong , et al. August 11, 2 | 2015-08-11 |
| Power Semiconductor Module App 20150214126 - KIM; Kwang Soo ; et al. | 2015-07-30 |
| Heat radiating substrate and method for manufacturing the same Grant 9,089,072 - Lee , et al. July 21, 2 | 2015-07-21 |
| Heat Radiation System For Power Semiconductor Module App 20150156914 - KWAK; Young Hoon ; et al. | 2015-06-04 |
| Power Semiconductor Module App 20150156909 - Kwak; Young Hoon ; et al. | 2015-06-04 |
| External Connection Terminal, Semiconductor Package Having External Connection Terminal, And Methods For Manufacturing The Same App 20150091177 - Hong; Chang Seob ; et al. | 2015-04-02 |
| External Connection Terminal, Semiconductor Package Having External Connection Terminal And Method Of Manufacturing The Same App 20150091152 - JO; Eun Jung ; et al. | 2015-04-02 |
| Semiconductor device Grant D717,254 - Jo , et al. November 11, 2 | 2014-11-11 |
| Semiconductor device Grant D717,253 - Jo , et al. November 11, 2 | 2014-11-11 |
| Semiconductor package Grant 8,866,288 - Kim , et al. October 21, 2 | 2014-10-21 |
| Housing And Power Module Having The Same App 20140285972 - Hong; Chang Seob ; et al. | 2014-09-25 |
| Housing And Power Module Having The Same App 20140285973 - HONG; Chang Seob ; et al. | 2014-09-25 |
| Semiconductor package including conductive member disposed between the heat dissipation member and the lead frame Grant 8,810,014 - Lim , et al. August 19, 2 | 2014-08-19 |
| Cooling System Of Power Semiconductor Device App 20140124182 - KWAK; Young Hoon ; et al. | 2014-05-08 |
| Semiconductor Package App 20140117522 - LIM; Jae Hyun ; et al. | 2014-05-01 |
| Power Module Package App 20140118961 - Hong; Chang Seob ; et al. | 2014-05-01 |
| Semiconductor Package App 20140110830 - Kim; Jong Man ; et al. | 2014-04-24 |
| Heat Radiating Substrate And Method Of Manufacturing The Same App 20140110156 - Lee; Young Ki ; et al. | 2014-04-24 |
| Heat Radiating Substrate And Method For Manufacturing The Same App 20140092563 - Lee; Young Ki ; et al. | 2014-04-03 |
| Multi-stage Heat Sink, Cooling System With The Same And Method For Controlling The Same App 20140014313 - Hong; Chang Seob ; et al. | 2014-01-16 |
| Heat Sink App 20130146259 - Oh; Kyu Hwan ; et al. | 2013-06-13 |
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