Honda; Tsuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Honda; Tsuyoshi.The latest application filed is for "gas shutoff device".

Company Profile

0.14.16

Honda; Tsuyoshi - Kyoto N/A JP
Honda; Tsuyoshi - Yokosuka JP
Honda; Tsuyoshi - Annaka JP
Honda; Tsuyoshi - Osaka JP
Honda; Tsuyoshi - Kanagawa-ken JP
Honda; Tsuyoshi - Gunma JP
Honda; Tsuyoshi - Annaka-shi JP
Honda; Tsuyoshi - Gunma-ken JP
Honda, Tsuyoshi - Gurma-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Gas shutoff device Grant 8,522,815 - Honda , et al. September 3, 2	2013-09-03
Temporary drainage system and temporary drainage method Grant 8,496,023 - Honda July 30, 2	2013-07-30
Adhesive composition suitable to be applied by screen printing Grant 8,110,066 - Kanamaru , et al. February 7, 2	2012-02-07
Gas Shutoff Device App 20110247711 - Honda; Tsuyoshi ; et al.	2011-10-13
Appliance Monitoring Apparatus App 20110077874 - Honda; Tsuyoshi ; et al.	2011-03-31
Appliance Monitoring Apparatus App 20110066387 - Honda; Tsuyoshi ; et al.	2011-03-17
Die bonding agent and a semiconductor device made by using the same Grant 7,901,992 - Honda , et al. March 8, 2	2011-03-08
Temporary Drainage System And Temporary Drainage Method App 20110023967 - Honda; Tsuyoshi	2011-02-03
Adhesive composition and a method of using the same Grant 7,855,245 - Honda , et al. December 21, 2	2010-12-21
Epoxy Resin Composition and Die Bonding Material Comprising the Composition App 20090133833 - Honda; Tsuyoshi ; et al.	2009-05-28
Adhesive composition suitable to be applied by screen printing App 20080308225 - Kanamaru; Tatsuya ; et al.	2008-12-18
Die bonding agent and a semiconductor device made by using the same App 20080265439 - Honda; Tsuyoshi ; et al.	2008-10-30
Adhesive composition and a method of using the same App 20080268255 - Honda; Tsuyoshi ; et al.	2008-10-30
Epoxy resin composition and semiconductor device Grant 7,169,474 - Honda January 30, 2	2007-01-30
Liquid epoxy resin composition and semiconductor device App 20050152773 - Sumita, Kazuaki ; et al.	2005-07-14
Flip-chip type semiconductor device Grant 6,794,058 - Honda , et al. September 21, 2	2004-09-21
Epoxy resin composition and semiconductor device App 20040155334 - Honda, Tsuyoshi	2004-08-12
Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith Grant 6,709,753 - Honda , et al. March 23, 2	2004-03-23
Conductive resin compositions and electronic parts using the same Grant 6,680,007 - Honda , et al. January 20, 2	2004-01-20
Film-type adhesive for electronic components, and electronic components bonded therewith Grant 6,645,632 - Honda , et al. November 11, 2	2003-11-11
Light-transmissive epoxy resin composition and semiconductor device Grant 6,627,328 - Kanamaru , et al. September 30, 2	2003-09-30
Flip-chip type semiconductor device App 20030144382 - Honda, Tsuyoshi ; et al.	2003-07-31
Conductive resin compositions and electronic parts using the same App 20030078322 - Honda, Tsuyoshi ; et al.	2003-04-24
Epoxy resin composition, laminate film using the same, and semiconductor device Grant 6,512,031 - Honda , et al. January 28, 2	2003-01-28
Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith App 20020192477 - Honda, Tsuyoshi ; et al.	2002-12-19
Light-transmissive epoxy resin composition and semiconductor device App 20020058145 - Kanamaru, Tatsuya ; et al.	2002-05-16
Light-transmissive epoxy resin composition and flip-chip type semiconductor device App 20020058742 - Honda, Tsuyoshi ; et al.	2002-05-16
Film-type adhesive for electronic components, and electronic components bonded therewith App 20010031828 - Honda, Tsuyoshi ; et al.	2001-10-18

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