Honda; Tomoko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Honda; Tomoko.The latest application filed is for "electronic apparatus".
- Honda; Tomoko - Tokyo N/A JP
- Honda; Tomoko - Kanagawa-ken JP
| Patent | Date |
|---|---|
| Low-temperature curable conductive paste for plating and electric wiring using the same Grant 8,986,575 - Akiba , et al. March 24, 2 | 2015-03-24 |
| Electronic Apparatus App 20140306849 - Hata; Yoshikazu ; et al. | 2014-10-16 |
| Electronic apparatus Grant 8,812,062 - Hata , et al. August 19, 2 | 2014-08-19 |
| Electronic apparatus Grant 8,130,170 - Nakahata , et al. March 6, 2 | 2012-03-06 |
| Electronic apparatus Grant 8,054,240 - Honda , et al. November 8, 2 | 2011-11-08 |
| Electronic device and method for manufacturing same Grant 7,907,093 - Honda , et al. March 15, 2 | 2011-03-15 |
| Low-temperature Curable Conductive Paste For Plating And Electric Wiring Using The Same App 20100101842 - AKIBA; Yuichiro ; et al. | 2010-04-29 |
| Casing And Method For Manufacturing Same, And Electronic Device App 20090082075 - Honda; Tomoko ; et al. | 2009-03-26 |
| Electronic Device And Method For Manufacturing Same App 20090015490 - HONDA; Satoru ; et al. | 2009-01-15 |
| Electronic Device And Method For Manufacturing Same App 20080303737 - HONDA; Satoru ; et al. | 2008-12-11 |
| Electronic apparatus App 20080182539 - Hata; Yoshikazu ; et al. | 2008-07-31 |
| Electronic apparatus App 20080150811 - Honda; Tomoko ; et al. | 2008-06-26 |
| Electronic apparatus App 20080150815 - Nakahata; Masaomi ; et al. | 2008-06-26 |
| Thermoplastic material for sealing a semiconductor element, semiconductor device sealed by the material, and the process for manufacturing the same Grant 6,201,309 - Honda , et al. March 13, 2 | 2001-03-13 |
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