Honda; Teruo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Honda; Teruo.The latest application filed is for "wafer chuck, exposure system, and method of manufacturing semiconductor device".
- Honda; Teruo - Ome JP
- Honda, Teruo - Ome-shi JP
- Honda; Teruo - Hiratsuka JA
| Patent | Date |
|---|---|
| Wafer chuck, exposure system, and method of manufacturing semiconductor device Grant 6,664,549 - Kobayashi , et al. December 16, 2 | 2003-12-16 |
| Wafer chuck, exposure system, and method of manufacturing semiconductor device App 20030001103 - Kobayashi, Seiichiro ; et al. | 2003-01-02 |
| Powder coating of epoxy resin, acrylic copolymer and tertiary amine Grant 3,954,898 - Hirota , et al. May 4, 1 | 1976-05-04 |
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