loadpatents
name:-0.023522138595581
name:-0.013648986816406
name:-0.0017540454864502
Honda; Shiro Patent Filings

Honda; Shiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Honda; Shiro.The latest application filed is for "block copolymer and method of producing same, epoxy resin composition and cured product thereof, and semiconductor encapsulating material".

Company Profile
2.16.22
  • Honda; Shiro - Nagoya JP
  • Honda; Shiro - Aichi JP
  • Honda; Shiro - Nagoya-shi JP
  • Honda; Shiro - Ehime JP
  • Honda; Shiro - Masaki-Cho JP
  • Honda; Shiro - Yamaguchi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Block copolymer and method of producing same, epoxy resin composition and cured product thereof, and semiconductor encapsulating material
Grant 11,104,766 - Tanaka , et al. August 31, 2
2021-08-31
Block Copolymer And Method Of Producing Same, Epoxy Resin Composition And Cured Product Thereof, And Semiconductor Encapsulating Material
App 20200377670 - Tanaka; Hiroko ;   et al.
2020-12-03
Two-component type epoxy resin composition for fiber-reinforced composite material, and fiber-reinforced composite material
Grant 10,717,831 - Oka , et al.
2020-07-21
Reinforcing fiber fabric substrate, preform, and fiber-reinforced composite material
Grant 10,400,077 - Hirano , et al. Sep
2019-09-03
Method of producing carbon nanotube-containing composition
Grant 10,266,411 - Hirai , et al.
2019-04-23
Binder resin composition for preform, binder particle, preform, and fiber-reinforced composite material
Grant 10,053,575 - Hirano , et al. August 21, 2
2018-08-21
Method Of Producing Carbon Nanotube-containing Composition
App 20180170758 - Hirai; Takayoshi ;   et al.
2018-06-21
Two-component Type Epoxy Resin Composition For Fiber-reinforced Composite Material, And Fiber-reinforced Composite Material
App 20180057645 - Oka; Hideki ;   et al.
2018-03-01
Reinforcing Fiber Fabric Substrate, Preform, And Fiber-reinforced Composite Material
App 20160289406 - Hirano; Masanori ;   et al.
2016-10-06
Two-pack Epoxy Resin Composition For Fiber-reinforced Composite Materials, And Fiber-reinforced Composite Material
App 20160237273 - Oka; Hideki ;   et al.
2016-08-18
Epoxy resin composition for resin transfer molding of fiber-reinforced composite material, fiber-reinforced composite material, and method for producing same
Grant 9,309,352 - Oka , et al. April 12, 2
2016-04-12
Binder Resin Composition For Preform, Binder Particle, Preform, And Fiber-reinforced Composite Material
App 20150322257 - Hirano; Masanori ;   et al.
2015-11-12
Resin Composition And Semiconductor Mounting Substrate Obtained By Molding Same
App 20150017450 - Oka; Hideki ;   et al.
2015-01-15
Epoxy Resin Composition, Prepreg And Fiber-reinforced Composite Material
App 20140100320 - NAGANO; Maki ;   et al.
2014-04-10
Epoxy resin composition, prepreg and fiber-reinforced composite material
Grant 8,658,736 - Honda , et al. February 25, 2
2014-02-25
Epoxy Resin Composition For Resin Transfer Molding Of Fiber-reinforced Composite Material, Fiber-reinforced Composite Material, And Method For Producing Same
App 20130303661 - Oka; Hideki ;   et al.
2013-11-14
Epoxy Resin Composition For Fiber-reinforced Composite Materials, Prepreg, And Fiber-reinforced Composite Material
App 20130281573 - Goto; Yuko ;   et al.
2013-10-24
Epoxy resins, curing agent and (Co)poly(methyl methacrylate) block copolymer
Grant 8,338,535 - Sakata , et al. December 25, 2
2012-12-25
Epoxy resin composition, prepreg, and fiber reinforced composite material
Grant 8,309,631 - Tomioka , et al. November 13, 2
2012-11-13
Epoxy resin composition, prepreg, fiber-reinforced composite material
Grant 8,278,389 - Tomioka , et al. October 2, 2
2012-10-02
Fiber-reinforced composite sheet
App 20120058325 - Honma; Masato ;   et al.
2012-03-08
Epoxy Resin Composition, Prepreg, Carbon Fiber Reinforced Composite Material, And Housing For Electronic Or Electrical Component
App 20110319525 - Maeda; Yuki ;   et al.
2011-12-29
Aromatic Polyethersulfone Having Hydroxyphenyl End Groups And Method For Producing The Same
App 20110311816 - Kanomata; Akinori ;   et al.
2011-12-22
Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite sheet, and casing for electrical/electronic equipment
Grant 8,021,752 - Honda , et al. September 20, 2
2011-09-20
Epoxy Resin Composition, Prepreg And Fiber-reinforced Composite Material
App 20110184091 - Mizuki; Maki ;   et al.
2011-07-28
Epoxy Resin Composition, Prepreg, And Fiber Reinforced Composite Material
App 20110009528 - Tomioka; Nobuyuki ;   et al.
2011-01-13
Molding material, prepreg and fiber-reinforced composite material, and method for producing fiber-reinforced molding substrate
Grant 7,824,770 - Honma , et al. November 2, 2
2010-11-02
Epoxy Resin Composition, Prepreg, Fiber-reinforced Composite Material
App 20100209642 - Tomioka; Nobuyuki ;   et al.
2010-08-19
Molding Material, Prepreg And Fiber-reinforced Composite Material, And Method For Producing Fiber-reinforced Molding Substrate
App 20100068518 - Honma; Masato ;   et al.
2010-03-18
Epoxy Resin Composition, Prepreg, And Fiber-reinforced Composite Material
App 20090198012 - Sakata; Hiroaki ;   et al.
2009-08-06
Epoxy Resin Composition, Fiber-reinforced Composite Material And Production Method Of The Same
App 20090131556 - Honda; Shiro ;   et al.
2009-05-21
Epoxy Resin Composition for Carbon-Fiber-Reinforced Composite Material, Prepreg, Integrated Molding, Fiber-Reinforced Composite Sheet, and Casing for Electrical/Electronic Equipment
App 20080166511 - Honma; Masato ;   et al.
2008-07-10
Semiconductor device-encapsulating epoxy resin composition
Grant 5,360,837 - Honda , et al. November 1, 1
1994-11-01
Treatment of waste water by the activated sludge process
Grant 4,749,494 - Tomoyasu , et al. June 7, 1
1988-06-07

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