Honda; Noriyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Honda; Noriyuki.The latest application filed is for "image processing apparatus".

Company Profile

0.21.17

Honda; Noriyuki - Tokyo JP
Honda; Noriyuki - Kawasaki JP
Honda; Noriyuki - Aichi JP
Honda; Noriyuki - Utsunomiya JP
Honda; Noriyuki - Kawasaki-shi JP
Honda; Noriyuki - Miyagi-ken JP
Honda; Noriyuki - Kanagawa JP
Honda; Noriyuki - Utsunomiya-shi JP
Honda; Noriyuki - Obu JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Image processing apparatus Grant 9,235,791 - Honda January 12, 2	2016-01-12
Image forming apparatus Grant 9,014,579 - Honda April 21, 2	2015-04-21
Image Processing Apparatus App 20150092245 - HONDA; Noriyuki	2015-04-02
Image Forming Apparatus App 20140199087 - HONDA; Noriyuki	2014-07-17
Database creation method, database device and design data evaluation method Grant 8,195,697 - Maeda , et al. June 5, 2	2012-06-05
Method of holding a veneer sheet Grant 7,946,321 - Abe , et al. May 24, 2	2011-05-24
Method and device for machining flange part of wheel arch Grant 7,614,269 - Honda , et al. November 10, 2	2009-11-10
Database Creation Method, Database Device And Design Data Evaluation Method App 20090187590 - MAEDA; Shimon ; et al.	2009-07-23
Receiving device and tire pressure monitoring system Grant 7,541,949 - Miura , et al. June 2, 2	2009-06-02
Method of holding a veneer sheet App 20080264520 - Abe; Yukio ; et al.	2008-10-30
Method and apparatus of pressing in manufacturing glued laminated wood Grant 7,401,632 - Abe , et al. July 22, 2	2008-07-22
Receiving Device And Tire Pressure Monitoring System App 20080111717 - Miura; Yukio ; et al.	2008-05-15
Receiving device and tire pressure monitoring system Grant 7,342,519 - Miura , et al. March 11, 2	2008-03-11
Electrical connection materials and electrical connection method Grant 7,244,675 - Honda , et al. July 17, 2	2007-07-17
Method and apparatus of manufacturing glued laminated wood Grant 7,160,414 - Abe , et al. January 9, 2	2007-01-09
Receiving device and tire pressure monitoring system App 20060256691 - Miura; Yukio ; et al.	2006-11-16
Method and device for machining flange part of wheel arch App 20060218986 - Honda; Noriyuki ; et al.	2006-10-05
Electrical connection materials and electrical connection methods Grant 7,078,807 - Honda , et al. July 18, 2	2006-07-18
Semiconductor device using bumps, method for fabricating same, and method for forming bumps Grant 7,015,131 - Iwatsu , et al. March 21, 2	2006-03-21
Semiconductor device using bumps, method for fabricating same, and method for forming bumps Grant 7,005,743 - Iwatsu , et al. February 28, 2	2006-02-28
Method and apparatus of manufacturing glued laminated wood App 20060027319 - Abe; Yukio ; et al.	2006-02-09
Electrical connection materials and electrical connection methods App 20050194680 - Honda, Noriyuki ; et al.	2005-09-08
Method of manufacturing glued laminated wood Grant 6,878,230 - Abe , et al. April 12, 2	2005-04-12
Method and apparatus of pressing in manufacturing glued laminated wood App 20050056366 - Abe, Yukio ; et al.	2005-03-17
Semiconductor device using bumps, method for fabricating same, and method for forming bumps App 20050045912 - Iwatsu, Satoshi ; et al.	2005-03-03
Semiconductor device using bumps, method for fabricating same, and method for forming bumps App 20050037602 - Iwatsu, Satoshi ; et al.	2005-02-17
Electrical connecting device and electrical connecting method Grant 6,835,274 - Honda , et al. December 28, 2	2004-12-28
Semiconductor device using bumps, method for fabricating same, and method for forming bumps Grant 6,812,569 - Iwatsu , et al. November 2, 2	2004-11-02
Method of manufacturing glued laminated wood App 20040060634 - Abe, Yukio ; et al.	2004-04-01
Semiconductor device using bumps, method for fabricating same, and method for forming bumps Grant 6,614,111 - Iwatsu , et al. September 2, 2	2003-09-02
Semiconductor device using bumps, method for fabricating same, and method for forming bumps App 20030022478 - Iwatsu, Satoshi ; et al.	2003-01-30
Electrical connection materials and electrical connection method App 20020173145 - Honda, Noriyuki ; et al.	2002-11-21
Electrical connecting device and electrical connecting method App 20020056505 - Honda, Noriyuki ; et al.	2002-05-16
Electrical connecting device and electrical connecting method Grant 6,365,840 - Honda , et al. April 2, 2	2002-04-02
Semiconductor device using bumps, method for fabricating same, and method for forming bumps App 20020024110 - Iwatsu, Satoshi ; et al.	2002-02-28
Electrical connection device employing an anisotropic electrically conductive film Grant 6,332,786 - Suga , et al. December 25, 2	2001-12-25
Veneer-pressing apparatus Grant 5,875,710 - Honda , et al. March 2, 1	1999-03-02
Leading end stacked position regulating apparatus in thin sheet material stacker Grant 5,562,281 - Honda , et al. October 8, 1	1996-10-08

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