Honda; Hiromi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Honda; Hiromi.The latest application filed is for "printed wiring board and electronic apparatus".

Company Profile

0.3.6

Honda; Hiromi - Utsunomiya JP
Honda; Hiromi - Ibaraki JP
Honda, Hiromi - Utsunomiya-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Latent catalyst Grant 6,946,421 - Miyake , et al. September 20, 2	2005-09-20
Thermosetting resin and tetraorganophosphonium dicyclic tetraorganoborane catalyst Grant 6,881,812 - Miyake , et al. April 19, 2	2005-04-19
Printed wiring board and electronic apparatus Grant 6,849,805 - Honda , et al. February 1, 2	2005-02-01
Printed wiring board and electronic apparatus App 20050013978 - Honda, Hiromi ; et al.	2005-01-20
Latent catalyst App 20040034125 - Miyake, Sumiya ; et al.	2004-02-19
Thermosetting resin composition, epoxy resin molding material and semiconductor device respectively using latent catalyst App 20030199391 - Miyake, Sumiya ; et al.	2003-10-23
Printed wiring board and electronic apparatus App 20020086144 - Honda, Hiromi ; et al.	2002-07-04
Latent catalyst, thermosetting resin composition comprising the catalyst, epoxy resin molding material comprising the catalyst, and semiconductor device App 20010037003 - Miyake, Sumiya ; et al.	2001-11-01
Semiconductor device encapsulated with epoxy resin composition comprising latent catalyst App 20010021454 - Miyake, Sumiya ; et al.	2001-09-13

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