Honda; Hirokazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Honda; Hirokazu.The latest application filed is for "manufacturing method for semiconductor device".

Company Profile

0.36.39

Honda; Hirokazu - Kanagawa JP
Honda; Hirokazu - Omitama-shi JP
Honda; Hirokazu - Tokyo JP
Honda; Hirokazu - Ibi-gun JP
Honda; Hirokazu - Kawasaki-shi JP
Honda; Hirokazu - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic device Grant 10,098,179 - Yamamichi , et al. October 9, 2	2018-10-09
Semiconductor package Grant 9,635,762 - Watanabe , et al. April 25, 2	2017-04-25
Manufacturing method for semiconductor device Grant 9,368,474 - Matsubara , et al. June 14, 2	2016-06-14
Heat sink in the aperture of substrate Grant 9,362,200 - Honda , et al. June 7, 2	2016-06-07
Semiconductor device Grant 9,362,262 - Yamamichi , et al. June 7, 2	2016-06-07
Manufacturing Method For Semiconductor Device App 20160079204 - Matsubara; Hiroaki ; et al.	2016-03-17
Lighting device having LED elements Grant 9,271,363 - Takatsu February 23, 2	2016-02-23
Semiconductor Package App 20160027715 - WATANABE; Shinji ; et al.	2016-01-28
Semiconductor Package And Method Of Manufacturing The Same App 20150371934 - HONDA; Hirokazu ; et al.	2015-12-24
Semiconductor Device App 20150333048 - Yamamichi; Shintaro ; et al.	2015-11-19
Semiconductor device Grant 9,117,814 - Yamamichi , et al. August 25, 2	2015-08-25
Semiconductor Device App 20140361410 - Yamamichi; Shintaro ; et al.	2014-12-11
Electronic Device App 20140329476 - YAMAMICHI; Shintaro ; et al.	2014-11-06
Method of manufacturing a wiring board Grant 8,389,414 - Kikuchi , et al. March 5, 2	2013-03-05
Warp-suppressed semiconductor device Grant 8,324,718 - Honda December 4, 2	2012-12-04
Semiconductor device Grant 8,304,905 - Matsui , et al. November 6, 2	2012-11-06
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package Grant 8,198,140 - Murai , et al. June 12, 2	2012-06-12
Semiconductor Device App 20120025371 - MATSUI; Satoshi ; et al.	2012-02-02
Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board Grant 8,008,130 - Honda August 30, 2	2011-08-30
Method Of Manufacturing A Wiring Board App 20110136298 - KIKUCHI; Katsumi ; et al.	2011-06-09
Ceramic Wiring Board And Method Of Manufacturing Thereof App 20110079418 - FURUICHI; Wataru ; et al.	2011-04-07
Wiring board, semiconductor device using wiring board and their manufacturing methods Grant 7,911,038 - Kikuchi , et al. March 22, 2	2011-03-22
Wiring Substrate For Mounting Semiconductors, Method Of Manufacturing The Same, And Semiconductor Package App 20110003472 - MURAI; Hideya ; et al.	2011-01-06
Wiring board, method for manufacturing same, and semiconductor package Grant 7,838,779 - Yamamichi , et al. November 23, 2	2010-11-23
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package Grant 7,816,782 - Murai , et al. October 19, 2	2010-10-19
Wiring Board Composite Body, Semiconductor Device, And Method For Manufacturing The Wiring Board Composite Body And The Semiconductor Device App 20100232127 - Mori; Kentaro ; et al.	2010-09-16
Warp-suppressed Semiconductor Device App 20100230797 - Honda; Hirokazu	2010-09-16
Warp-suppressed semiconductor device Grant 7,728,440 - Honda June 1, 2	2010-06-01
Wiring board and method for manufacturing the same Grant 7,674,989 - Kikuchi , et al. March 9, 2	2010-03-09
Wiring Board, Semiconductor Device Using Wiring Board And Their Manufacturing Methods App 20090315190 - Kikuchi; Katsumi ; et al.	2009-12-24
Wiring board and semiconductor package using the same Grant 7,566,834 - Shimoto , et al. July 28, 2	2009-07-28
Method of forming a connecting conductor and wirings of a semiconductor chip Grant 7,498,249 - Miyazaki , et al. March 3, 2	2009-03-03
Wiring Board For Mounting Semiconductor Device, Manufacturing Method Of The Same, And Wiring Board Assembly App 20090046441 - Funaya; Takuo ; et al.	2009-02-19
Method Of Manufacturing Interconnect Substrate And Semiconductor Device App 20090017613 - HONDA; Hirokazu	2009-01-15
Wiring Board And Semiconductor Package Using The Same App 20080258283 - SHIMOTO; Tadanori ; et al.	2008-10-23
Semiconductor device having stress alleviating portion positioned at outer circumference of chip, wiring substrate, and method for producing the same App 20080203564 - Motoyoshi; Souichirou ; et al.	2008-08-28
Wiring board and semiconductor package using the same Grant 7,397,000 - Shimoto , et al. July 8, 2	2008-07-08
Semiconductor device Grant 7,348,673 - Kikuchi , et al. March 25, 2	2008-03-25
Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board App 20070184604 - Honda; Hirokazu	2007-08-09
Interconnect substrate, semiconductor device, and method of manufacturing the same App 20070178686 - Honda; Hirokazu	2007-08-02
Multilayer wiring substrate, and method of producing same Grant 7,233,066 - Kata , et al. June 19, 2	2007-06-19
Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board Grant 7,217,999 - Honda May 15, 2	2007-05-15
Method of forming a connecting conductor and wirings of a semiconductor chip App 20070020907 - Miyazaki; Shinichi ; et al.	2007-01-25
Wiring board and method for manufacturing the same App 20060283629 - Kikuchi; Katsumi ; et al.	2006-12-21
Wiring board, method for manufacturing same, and semiconductor package App 20060283625 - Yamamichi; Shintaro ; et al.	2006-12-21
Semiconductor device and method of manufacturing the same Grant 7,138,064 - Honda November 21, 2	2006-11-21
Multilayer wiring substrate, and method of producing same App 20060189125 - Kata; Keiichiro ; et al.	2006-08-24
Flip-chip type semiconductor device and method of manufacturing the same Grant 7,074,650 - Honda July 11, 2	2006-07-11
Multilayer wiring substrate, and method of producing same Grant 7,060,604 - Kata , et al. June 13, 2	2006-06-13
Semiconductor device App 20060012029 - Kikuchi; Katsumi ; et al.	2006-01-19
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package App 20060012048 - Murai; Hideya ; et al.	2006-01-19
Wiring board and semiconductor package using the same App 20050252682 - Shimoto, Tadanori ; et al.	2005-11-17
Flip-chip type semiconductor device and method of manufacturing the same App 20040169287 - Honda, Hirokazu	2004-09-02
Method of forming a connecting conductor and wirings of a semiconductor chip App 20040154163 - Miyazaki, Shinichi ; et al.	2004-08-12
Warp-suppressed semiconductor device App 20040150118 - Honda, Hirokazu	2004-08-05
Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin Grant 6,767,761 - Honda July 27, 2	2004-07-27
Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrate App 20040089470 - Shimoto, Tadanori ; et al.	2004-05-13
Recyclable flip-chip semiconductor device Grant 6,734,566 - Honda May 11, 2	2004-05-11
Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin App 20040082101 - Honda, Hirokazu	2004-04-29
Method for manufacturing semiconductor devices Grant 6,723,627 - Kariyazaki , et al. April 20, 2	2004-04-20
Multilayer wiring substrate, and method of producing same App 20040053489 - Kata, Keiichiro ; et al.	2004-03-18
Flip chip type semiconductor device and method of manufacturing the same Grant 6,696,764 - Honda February 24, 2	2004-02-24
Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin Grant 6,696,317 - Honda February 24, 2	2004-02-24
Resin-encapsulated semiconductor device Grant 6,611,063 - Ichinose , et al. August 26, 2	2003-08-26
Semiconductor device and method of manufacturing the same App 20030157810 - Honda, Hirokazu	2003-08-21
Flip chip type semiconductor device and method of manufacturing the same App 20030137057 - Honda, Hirokazu	2003-07-24
Flip chip type semiconductor device and method for manufacturing the same App 20020121689 - Honda, Hirokazu	2002-09-05
Semiconductor device having a flip chip cavity with lower stress and method for forming same Grant 6,445,062 - Honda September 3, 2	2002-09-03
Flip chip type semiconductor device and method for manufacturing the same Grant 6,406,942 - Honda June 18, 2	2002-06-18
Film Carrier Semiconductor Device App 20020063331 - HONDA, HIROKAZU	2002-05-30
Semiconductor device and manufacturing method the same App 20020064935 - Honda, Hirokazu	2002-05-30
Flip-chip type semiconductor device and method of manufacturing the same App 20010026021 - Honda, Hirokazu	2001-10-04
Flip chip type semiconductor device and method for manufacturing the same App 20010020739 - Honda, Hirokazu	2001-09-13
Film carrier tape for semiconductor package and semiconductor device employing the same Grant 5,704,593 - Honda January 6, 1	1998-01-06

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