Hommel; Detlef
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hommel; Detlef.The latest application filed is for "method for wafer bonding (al, in, ga)n and zn(s, se) for optoelectronic applications".
- Hommel; Detlef - Bremen DE
| Patent | Date |
|---|---|
| Method for wafer bonding (A1, In, Ga)N and Zn(S, Se) for optoelectronic applications Grant 7,344,958 - Murai , et al. March 18, 2 | 2008-03-18 |
| Method for wafer bonding (Al, In, Ga)N and Zn(S, Se) for optoelectronic applications App 20060009006 - Murai; Akihiko ; et al. | 2006-01-12 |
| Semiconductor component for generating polychromatic electromagnetic radiation Grant 6,900,466 - Hommel , et al. May 31, 2 | 2005-05-31 |
| Semiconductor component for generating polychromatic electromagnetic radiation App 20020008244 - Hommel, Detlef ; et al. | 2002-01-24 |
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