Holzl; Robert
Patent Applications and Registrations
Patent applications and USPTO patent grants for Holzl; Robert.The latest application filed is for "silicon wafer and process for producing it".
- Holzl; Robert - Postmunster DE
| Patent | Date |
|---|---|
| Silicon wafer and process for producing it Grant 7,235,863 - Seuring , et al. June 26, 2 | 2007-06-26 |
| SOI wafer and process for producing it Grant 7,122,865 - Holzl , et al. October 17, 2 | 2006-10-17 |
| Silicon wafer and process for producing it App 20050032376 - Seuring, Christoph ; et al. | 2005-02-10 |
| SOI wafer and process for producing IT App 20040251500 - Holzl, Robert ; et al. | 2004-12-16 |
| Process for the heat treatment of a silicon wafer, and silicon wafer produced Grant 6,803,331 - Holzl , et al. October 12, 2 | 2004-10-12 |
| Process for the heat treatment of a silicon wafer, and silicon wafer produced App 20030148634 - Holzl, Robert ; et al. | 2003-08-07 |
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