Holverson; Kristen L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Holverson; Kristen L..The latest application filed is for "thermally sensitive material embedded in the substrate".
- Holverson; Kristen L. - Williston VT
| Patent | Date |
|---|---|
| Thermally sensitive material embedded in the substrate Grant 8,426,856 - Ayotte , et al. April 23, 2 | 2013-04-23 |
| Low profile heat sink for semiconductor devices Grant 8,230,903 - Ayotte , et al. July 31, 2 | 2012-07-31 |
| Thermally Sensitive Material Embedded In The Substrate App 20120007074 - Ayotte; Stephen P. ; et al. | 2012-01-12 |
| Low Profile Heat Sink For Semiconductor Devices App 20090260778 - Ayotte; Stephen P. ; et al. | 2009-10-22 |
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