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name:-0.017139911651611
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Holscher; Richard D. Patent Filings

Holscher; Richard D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Holscher; Richard D..The latest application filed is for "use of a dual tone resist to form photomasks and intermediate semiconductor device structures".

Company Profile
0.13.14
  • Holscher; Richard D. - Boise ID
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Intermediate semiconductor device structures
Grant 7,821,142 - Holscher , et al. October 26, 2
2010-10-26
Methods of forming openings, and methods of forming container capacitors
Grant 7,538,036 - Busch , et al. May 26, 2
2009-05-26
Use Of A Dual Tone Resist To Form Photomasks And Intermediate Semiconductor Device Structures
App 20080251951 - Holscher; Richard D. ;   et al.
2008-10-16
Method, apparatus and system providing imaging device with color filter array
App 20080204580 - Holscher; Richard D.
2008-08-28
Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates
Grant 7,408,265 - Holscher , et al. August 5, 2
2008-08-05
Capacitor structures, and DRAM arrays
Grant 7,321,149 - Busch , et al. January 22, 2
2008-01-22
Method and apparatus defining a color filter array for an image sensor
App 20070238035 - Holscher; Richard D. ;   et al.
2007-10-11
Methods of forming openings, and methods of forming container capacitors
Grant 7,153,778 - Busch , et al. December 26, 2
2006-12-26
Methods of forming openings, and methods of forming container capacitors
App 20060009042 - Busch; Brett W. ;   et al.
2006-01-12
Capacitor structures, and DRAM arrays
App 20050269620 - Busch, Brett W. ;   et al.
2005-12-08
Methods of Forming Openings, And Methods of Forming Container Capacitors
App 20050186802 - Busch, Brett W. ;   et al.
2005-08-25
Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates
App 20040259320 - Holscher, Richard D. ;   et al.
2004-12-23
Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates
Grant 6,815,308 - Holscher , et al. November 9, 2
2004-11-09
Reticle for creating resist-filled vias in a dual damascene process
Grant 6,812,129 - Holscher November 2, 2
2004-11-02
Automated combi deposition apparatus and method
Grant 6,768,213 - Holscher , et al. July 27, 2
2004-07-27
Overlay target design method to minimize impact of lens aberrations
Grant 6,756,167 - Baluswamy , et al. June 29, 2
2004-06-29
Reticle for creating resist-filled vias in a dual damascene process
App 20040038539 - Holscher, Richard D.
2004-02-26
Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates
App 20040032031 - Holscher, Richard D. ;   et al.
2004-02-19
Reticle for creating resist-filled vias in a dual damascene process
Grant 6,639,320 - Holscher October 28, 2
2003-10-28
Overlay target design method minimize impact of lens aberrations
App 20030091916 - Baluswamy, Pary ;   et al.
2003-05-15
Overlay target design method to minimize impact of lens aberrations
App 20020160284 - Baluswamy, Pary ;   et al.
2002-10-31
Overlay target design method with pitch determination to minimize impact of lens aberrations
Grant 6,432,591 - Baluswamy , et al. August 13, 2
2002-08-13
Use of DARC and BARC in flash memory processing
Grant 6,423,474 - Holscher July 23, 2
2002-07-23
In-line method of measuring effective three-leaf aberration coefficient of lithography projection systems
App 20020072131 - Holscher, Richard D.
2002-06-13
Automated combi deposition apparatus and method
App 20020052091 - Holscher, Richard D. ;   et al.
2002-05-02
Reticle for creating resist-filled vias in a dual damascene process
App 20020045107 - Holscher, Richard D.
2002-04-18
Reducing resist shrinkage during device fabrication
Grant 6,107,002 - Holscher , et al. August 22, 2
2000-08-22

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