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Patent applications and USPTO patent grants for Holmberg; Nicholas.The latest application filed is for "package substrates with multiple dice".
Patent | Date |
---|---|
Package substrates with multiple dice Grant 9,177,911 - Nickerson , et al. November 3, 2 | 2015-11-03 |
Package Substrates With Multiple Dice App 20140346679 - Nickerson; Robert ;   et al. | 2014-11-27 |
Package substrates with multiple dice Grant 8,742,597 - Nickerson , et al. June 3, 2 | 2014-06-03 |
Package Substrates With Multiple Dice App 20140001651 - Nickerson; Robert ;   et al. | 2014-01-02 |
Controlled-resistance capacitors, and methods of assembling same Grant 7,505,248 - Mehr , et al. March 17, 2 | 2009-03-17 |
Array capacitors for broadband decoupling applications Grant 7,495,336 - Auernheimer , et al. February 24, 2 | 2009-02-24 |
Array capacitors for broadband decoupling applications, and methods of operating same App 20070152301 - Auernheimer; Joel A. ;   et al. | 2007-07-05 |
Controlled-resistance capacitors, and methods of assembling same App 20070002520 - Mehr; Behrooz Z. ;   et al. | 2007-01-04 |
Interposer with signal and power supply through vias Grant 7,081,650 - Palanduz , et al. July 25, 2 | 2006-07-25 |
Multi-layer capacitor using dielectric layers having differing compositions App 20060001068 - Mosley; Larry E. ;   et al. | 2006-01-05 |
Interposer with signal and power supply through vias App 20040188826 - Palanduz, Cengiz A. ;   et al. | 2004-09-30 |
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