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Patent applications and USPTO patent grants for Holloway; Jeffrey G.The latest application filed is for "chip on lead with small power pad design".
Patent | Date |
---|---|
Non-pull back pad package with an additional solder standoff Grant 8,232,144 - Lange , et al. July 31, 2 | 2012-07-31 |
Chip On Lead With Small Power Pad Design App 20100171201 - Wyant; M. Todd ;   et al. | 2010-07-08 |
Integrated Circuits Having Controlled Inductances App 20070296056 - Coyle; Anthony L. ;   et al. | 2007-12-27 |
Design and Method for Attaching a Die to a Leadframe in a Semiconductor Device App 20070273010 - Holloway; Jeffrey G. ;   et al. | 2007-11-29 |
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