Hollaway; Roy Dale
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hollaway; Roy Dale.The latest application filed is for "optical module having cavity substrate".
- Hollaway; Roy Dale - Chandler AZ
- Hollaway; Roy Dale - Paranague Metro Manila PH
- Hollaway; Roy Dale - Paranaque Metro Manila PH
- Hollaway; Roy Dale - Metro Manila PH
- Hollaway; Roy Dale - Paranaque PH
| Patent | Date |
|---|---|
| Optical module having cavity substrate Grant 7,609,461 - Webster , et al. October 27, 2 | 2009-10-27 |
| Optical module with lens integral holder fabrication method Grant 7,059,040 - Webster , et al. June 13, 2 | 2006-06-13 |
| Wafer having alignment marks extending from a first to a second surface of the wafer Grant 6,943,429 - Glenn , et al. September 13, 2 | 2005-09-13 |
| Back-side wafer singulation method Grant 6,869,861 - Glenn , et al. March 22, 2 | 2005-03-22 |
| Flip chip on glass sensor package Grant 6,849,916 - Glenn , et al. February 1, 2 | 2005-02-01 |
| VCSEL package and fabrication method Grant 6,816,523 - Glenn , et al. November 9, 2 | 2004-11-09 |
| Optical track drain package Grant 6,765,801 - Glenn , et al. July 20, 2 | 2004-07-20 |
| Method for forming an image sensor package with vision die in lens housing Grant 6,734,419 - Glenn , et al. May 11, 2 | 2004-05-11 |
| Pre-drilled image sensor package fabrication method Grant 6,730,536 - Glenn , et al. May 4, 2 | 2004-05-04 |
| Method of fabricating and using an image sensor package with reflector Grant 6,717,126 - Glenn , et al. April 6, 2 | 2004-04-06 |
| Optical module with lens integral holder Grant 6,686,588 - Webster , et al. February 3, 2 | 2004-02-03 |
| Image sensor package with reflector Grant 6,686,580 - Glenn , et al. February 3, 2 | 2004-02-03 |
| Integrated circuit package mounting Grant 6,670,698 - Glenn , et al. December 30, 2 | 2003-12-30 |
| Structure for backside saw cavity protection Grant 6,661,080 - Glenn , et al. December 9, 2 | 2003-12-09 |
| Micromachine stacked wirebonded package fabrication method Grant 6,638,789 - Glenn , et al. October 28, 2 | 2003-10-28 |
| Thin image sensor package Grant 6,627,864 - Glenn , et al. September 30, 2 | 2003-09-30 |
| Micromirror device package fabrication method Grant 6,624,921 - Glenn , et al. September 23, 2 | 2003-09-23 |
| Method for fabricating a special-purpose die using a polymerizable tape Grant 6,610,167 - Glenn , et al. August 26, 2 | 2003-08-26 |
| Heat spreader with spring IC package Grant 6,580,167 - Glenn , et al. June 17, 2 | 2003-06-17 |
| Flip chip image sensor package fabrication method Grant 6,571,466 - Glenn , et al. June 3, 2 | 2003-06-03 |
| Heat spreader with spring IC package fabrication method Grant 6,562,655 - Glenn , et al. May 13, 2 | 2003-05-13 |
| Micromachine stacked flip chip package fabrication method Grant 6,530,515 - Glenn , et al. March 11, 2 | 2003-03-11 |
| Integrally connected image sensor packages having a window support in contact with a window and the active area Grant 6,515,269 - Webster , et al. February 4, 2 | 2003-02-04 |
| Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active area Grant 6,512,219 - Webster , et al. January 28, 2 | 2003-01-28 |
| Pre-drilled ball grid array package Grant 6,486,545 - Glenn , et al. November 26, 2 | 2002-11-26 |
| Micromirror device package Grant 6,455,927 - Glenn , et al. September 24, 2 | 2002-09-24 |
| Method for forming a reduced thickness packaged electronic device Grant 6,399,418 - Glenn , et al. June 4, 2 | 2002-06-04 |
| Method of singulation using laser cutting Grant 6,399,463 - Glenn , et al. June 4, 2 | 2002-06-04 |
| Thin image sensor package fabrication method Grant 6,396,043 - Glenn , et al. May 28, 2 | 2002-05-28 |
| Flip chip on glass image sensor package fabrication method Grant 6,342,406 - Glenn , et al. January 29, 2 | 2002-01-29 |
| Interdigitated wirebond programmable fixed voltage planes Grant 5,672,909 - Glenn , et al. September 30, 1 | 1997-09-30 |
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