loadpatents
Patent applications and USPTO patent grants for Hollaway; Roy D..The latest application filed is for "mounting for a package containing a chip".
Patent | Date |
---|---|
Mounting for a package containing a chip Grant 6,967,395 - Glenn , et al. November 22, 2 | 2005-11-22 |
Method of making near chip size integrated circuit package Grant 6,962,829 - Glenn , et al. November 8, 2 | 2005-11-08 |
Mounting for a package containing a chip Grant 6,777,789 - Glenn , et al. August 17, 2 | 2004-08-17 |
Ceramic semiconductor package and method for fabricating the package Grant 6,627,987 - Glenn , et al. September 30, 2 | 2003-09-30 |
Mounting for a package containing a chip Grant 6,545,345 - Glenn , et al. April 8, 2 | 2003-04-08 |
Angulated semiconductor packages Grant 6,532,157 - Glenn , et al. March 11, 2 | 2003-03-11 |
Semiconductor package with molded substrate and recessed input/output terminals Grant 6,528,869 - Glenn , et al. March 4, 2 | 2003-03-04 |
Chip-size semiconductor packages Grant 6,291,884 - Glenn , et al. September 18, 2 | 2001-09-18 |
Integrated circuit package having adhesive bead supporting planar lid above planar substrate Grant 6,268,654 - Glenn , et al. July 31, 2 | 2001-07-31 |
Near chip size integrated circuit package Grant 6,228,676 - Glenn , et al. May 8, 2 | 2001-05-08 |
Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate Grant 6,117,705 - Glenn , et al. September 12, 2 | 2000-09-12 |
Integrated circuit package Grant 6,034,429 - Glenn , et al. March 7, 2 | 2000-03-07 |
Near chip size integrated circuit package Grant 5,981,314 - Glenn , et al. November 9, 1 | 1999-11-09 |
Method of making an integrated circuit package Grant 5,950,074 - Glenn , et al. September 7, 1 | 1999-09-07 |
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