Hollatz; Mark

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hollatz; Mark.The latest application filed is for "method for producing a silicon ingot".

Company Profile

0.9.11

Hollatz; Mark - Dresden N/A DE
Hollatz; Mark - US
Hollatz; Mark - Neustadt DE
Hollatz; Mark - Neustadt/Sachsen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing a silicon ingot by solidification of a melt comprising a nucleation agent including nanoscale particles Grant 9,238,877 - Krause , et al. January 19, 2	2016-01-19
Device and method for the production of silicon blocks Grant 9,114,990 - Dietrich , et al. August 25, 2	2015-08-25
Method For Producing A Silicon Ingot App 20120175553 - Krause; Andreas ; et al.	2012-07-12
Method For Producing A Silicon Ingot App 20120175622 - Krause; Andreas ; et al.	2012-07-12
Method And Device For Producing Silicon Blocks App 20120167817 - FREUDENBERG; Bernhard ; et al.	2012-07-05
Device And Method For The Production Of Silicon Blocks App 20110305622 - DIETRICH; Marc ; et al.	2011-12-15
Device And Method For The Production Of Silicon Blocks App 20110203517 - Freudenberg; Bernhard ; et al.	2011-08-25
Method for fabricating a semiconductor structure Grant 7,326,612 - Hollatz February 5, 2	2008-02-05
Method for fabricating a semiconductor structure App 20060110872 - Hollatz; Mark	2006-05-25
Method for the planarization of a semiconductor structure Grant 7,030,017 - Hollatz , et al. April 18, 2	2006-04-18
Process and device for the abrasive machining of surfaces, in particular semiconductor wafers Grant 6,858,449 - Hollatz , et al. February 22, 2	2005-02-22
Method for fabricating a trench isolation structure App 20040253834 - Mothes, Kerstin ; et al.	2004-12-16
Process for the abrasive machining of surfaces, in particular of semiconductor wafers Grant 6,824,451 - Hollatz , et al. November 30, 2	2004-11-30
Method for the planarization of a semiconductor structure App 20040127040 - Hollatz, Mark ; et al.	2004-07-01
Semiconductor substrate holder for chemical-mechanical polishing containing a movable plate Grant 6,695,687 - Hollatz , et al. February 24, 2	2004-02-24
Process for the abrasive machining of surfaces, in particular of semiconductor wafers App 20030013389 - Hollatz, Mark ; et al.	2003-01-16
Process and device for the abrasive machining of surfaces, in particular semiconductor wafers App 20020197872 - Hollatz, Mark ; et al.	2002-12-26
Semiconductor substrate holder for chemical-mechanical polishing containing a movable plate App 20020177394 - Hollatz, Mark ; et al.	2002-11-28

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