Holcombe; Brent A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Holcombe; Brent A..The latest application filed is for "method and apparatus for probing at arbitrary locations within an inaccessible array of leads the solder balls or pins actually connecting a vlsi ic package to a substrate or socket".

Company Profile

0.12.11

Holcombe; Brent A. - Colorado Springs CO
Holcombe; Brent A. - Bellingham WA
Holcombe, Brent A. - Belllingham WA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Probe accessories, and methods for probing test points using same Grant 7,492,173 - LaMeres , et al. February 17, 2	2009-02-17
Method and apparatus for probing at arbitrary locations within an inaccessible array of leads the solder balls or pins actually connecting a VLSI IC package to a substrate or socket Grant 7,372,284 - Holcombe , et al. May 13, 2	2008-05-13
Regenerator probe Grant 7,282,935 - Wood , et al. October 16, 2	2007-10-16
Method and apparatus for probing at arbitrary locations within an inaccessible array of leads the solder balls or pins actually connecting a VLSI IC package to a substrate or socket App 20070176611 - Holcombe; Brent A. ; et al.	2007-08-02
Regenerator probe App 20070170936 - Wood; Glenn ; et al.	2007-07-26
Probe accessories, and methods for probing test point using same App 20070159191 - LaMeres; Brock J. ; et al.	2007-07-12
Signal probe and probe assembly Grant 7,242,202 - Groshong , et al. July 10, 2	2007-07-10
Signal probe and probe assembly App 20060267606 - Groshong; Joseph ; et al.	2006-11-30
Probe assembly with controlled impedance spring pin or resistor tip spring pin contacts Grant 7,116,121 - Holcombe , et al. October 3, 2	2006-10-03
Flexible ribbon probe for peripheral leads of an electronic part's package Grant 7,091,731 - Holcombe , et al. August 15, 2	2006-08-15
Probes with perpendicularly disposed spring pins, and methods of making and using same Grant 7,046,020 - LaMeres , et al. May 16, 2	2006-05-16
Probes with perpendicularly disposed spring pins, and methods of making and using same App 20050179454 - LaMeres, Brock J. ; et al.	2005-08-18
Probe for testing circuits, and associated methods Grant 6,867,609 - Holcombe , et al. March 15, 2	2005-03-15
Alignment/retention device for connector-less probe Grant 6,822,466 - Holcombe , et al. November 23, 2	2004-11-23
Connector-less probe App 20040164754 - Holcombe, Brent A. ; et al.	2004-08-26
Method for constructing a flex-rigid laminate probe Grant 6,750,669 - Holcombe June 15, 2	2004-06-15
Integrated ball grid array-pin grid array-flex laminate test assembly Grant 6,638,080 - Johnson , et al. October 28, 2	2003-10-28
Integrated ball grid array-pin grid array-flex circuit interposing probe assembly Grant 6,635,511 - Holcombe October 21, 2	2003-10-21
Electrical connector for interconnection of multiple printed circuit board ground planes App 20030186589 - Holcombe, Brent A. ; et al.	2003-10-02
Method for constructing a flex-rigid laminate probe App 20030006790 - Holcombe, Brent A.	2003-01-09
Integrated ball grid array-pin grid array-flex laminate assembly App 20030003780 - Johnson, Kenneth W. ; et al.	2003-01-02
Method for constructing a flex-rigid laminate probe App 20020093351 - Holcombe, Brent A.	2002-07-18
Integrated ball grid array-pin grid array-flex circuit interposing probe assembly App 20020094672 - Holcombe, Brent A.	2002-07-18

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