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Patent applications and USPTO patent grants for Holcomb; Melvin K..The latest application filed is for "non-planar sputter targets having crystlallographic orientations promoting uniform deposition".
Patent | Date |
---|---|
Non-planar sputter targets having crystallographic orientations promoting uniform deposition Grant 8,037,727 - Bailey , et al. October 18, 2 | 2011-10-18 |
Variable thickness plate for forming variable wall thickness physical vapor deposition target Grant 7,708,868 - Smathers , et al. May 4, 2 | 2010-05-04 |
Non-planar sputter targets having crystlallographic orientations promoting uniform deposition App 20090235709 - Bailey; Robert S. ;   et al. | 2009-09-24 |
Continuous Casting of Copper to Form Sputter Targets App 20070227688 - Holcomb; Melvin K. | 2007-10-04 |
Sputtering target assembly having low conductivity backing plate and method of making same App 20070107185 - Bailey; Robert S. ;   et al. | 2007-05-17 |
Variable thickness plate for forming variable wall thickness physical vapor deposition target App 20070007131 - Smathers; David B. ;   et al. | 2007-01-11 |
Insert target assembly and method of making same App 20020134675 - Holcomb, Melvin K. ;   et al. | 2002-09-26 |
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