Holcomb; Kenneth C

Patent Applications and Registrations

Patent applications and USPTO patent grants for Holcomb; Kenneth C.The latest application filed is for "structures for z-axis interconnection of multilayer electronic substrates".

Company Profile

0.5.4

Holcomb; Kenneth C - San Diego CA
Holcomb; Kenneth C. - San Diego CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structures for z-axis interconnection of multilayer electronic substrates Grant 9,545,017 - Hunrath , et al. January 10, 2	2017-01-10
Electrically conductive compositions comprising non-eutectic solder alloys Grant 9,005,330 - Shearer , et al. April 14, 2	2015-04-14
Preparation of metallurgic network compositions and methods of use thereof Grant 8,840,700 - Shearer , et al. September 23, 2	2014-09-23
Structures For Z-axis Interconnection Of Multilayer Electronic Substrates App 20140231126 - Hunrath; Christopher A ; et al.	2014-08-21
Electrically Conductive Compositions Comprising Non-eutectic Solder Alloys App 20140042212 - Shearer; Catherine ; et al.	2014-02-13
Conductive compositions containing blended alloy fillers Grant 8,221,518 - Shearer , et al. July 17, 2	2012-07-17
Preparation Of Metallurgic Network Compositions And Methods Of Use Thereof App 20110171372 - Shearer; Catherine ; et al.	2011-07-14
Conductive Compositions Containing Blended Alloy Fillers App 20100252616 - Shearer; Catherine ; et al.	2010-10-07

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