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name:-0.00045108795166016
name:-0.0056040287017822
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Hokamura; Sadakazu Patent Filings

Hokamura; Sadakazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hokamura; Sadakazu.The latest application filed is for "polyimide compositions for electrodeposition and coatings formed of the same".

Company Profile
0.5.0
  • Hokamura; Sadakazu - Kanagawa-ken JP
  • Hokamura; Sadakazu - Yamato JP
  • Hokamura; Sadakazu - Kamato JA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Polyimide compositions for electrodeposition and coatings formed of the same
Grant 5,741,599 - Oie , et al. April 21, 1
1998-04-21
Process for forming a corrosion resistant coating
Grant 4,514,445 - Hokamura , et al. April 30, 1
1985-04-30
Radiation curable epoxy ester-saturated alkyd compositions
Grant 3,882,187 - Takiyama , et al. May 6, 1
1975-05-06
Method For Curing Unsaturated Epoxy-ester Resinous Compositions Using An Organic Imide To Control Pot-life
Grant 3,819,551 - Hokamura , et al. June 25, 1
1974-06-25
Vinyl Ester Resins Prepared With An Addition Compound Of A Secondary Amine-acid Salt Catalyst
Grant 3,676,524 - Takiyama , et al. July 11, 1
1972-07-11

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